Empowering the Future of PCB Computing
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The computing infrastructure market is being reshaped by artificial intelligence, hyperscale data centers, and next-generation networking standards. AI accelerators, high-speed servers, and networking platforms require advanced PCB fabrication that supports:
- Tight signal integrity margins
- High-current power delivery
- Thermal management under continuous load
- Controlled impedance across complex multilayer stackups
- Reliable domestic manufacturing
AdvancedPCB supports AI hardware OEMs, hyperscale data center manufacturers, and networking equipment providers with high-layer-count, impedance-controlled PCB fabrication. As an experienced PCB manufacturer, we deliver precision multilayer boards designed for high-speed signaling, high-current power delivery, and continuous-load reliability.
Our U.S.-based manufacturing facilities support prototype through production builds for advanced computing platforms requiring tight process control and repeatable performance.
High Reliability PCB Applications We Support
AI Hardware Platforms
GPU accelerator boards
AI training clusters
Inference systems
Custom AI ASIC carrier boards
Data Center Equipment
Server motherboards
Backplanes
Power distribution boards
Network interface cards
High-Speed Servers
PCIe Gen5 / Gen6 platforms
CXL-enabled architectures
Multi-processor computing boards
Networking Equipment
Ethernet switches
Routers
Telecom infrastructure
Edge compute systems
Scaling from PCB Prototype to Global Production
Transitioning AI hardware and data center PCBs from prototype to global production requires more than validating electrical performance at low volume. Material availability, lamination consistency, impedance repeatability, and heavy copper processing must all be confirmed for sustained manufacturing at scale.
Early alignment between engineering and fabrication teams ensures stackup decisions made during prototyping remain stable, reliable, and supply-secure in volume production. Learn more about our Global Solutions.
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6 Reasons to Choose AdvancedPCB for Your Computing Needs
High-performance computing hardware requires disciplined fabrication to ensure reliable operation under extreme speed, current, and uptime requirements. With 40+ years of experience, AdvancedPCB provides customers with advanced technology capabilities including:
Unmatched Signal Integrity & Speed
- Controlled impedance and differential pair matching for PCIe, Ethernet, and high-speed serial communications
- Utilization of low-loss materials to enhance signal quality and reduce degradation
- Via technologies such as microvias and backdrilling to minimize signal reflections
Power Management & Thermal Solutions
- Heavy copper layers and thermal vias for effective heat dissipation from CPUs and ASICs
- Voltage regulation and power distribution networks
- Thermal analysis to ensure optimal performance in densely packed modules
Collaborative Engineering & DFM
- Proactive reviews of signal integrity and power integrity early in the design phase
- Stack-ups and thermal management strategies tailored to your project
- Expert support for ruggedization and achieving reliability benchmarks
Compact Design & High Density
- High-Density Interconnect (HDI) solutions and fine-line routing for maximizing PCB real estate
- Embedded components and innovative stack-ups for space-constrained CPU PCB applications
- Flex and rigid-flex designs enabling versatility in server and storage applications
Dependable Performance & Continuous Operations
- PCBs engineered for high availability and fault tolerance in critical applications
- Robust testing for environmental resilience against thermal cycling, humidity, and mechanical stress
- Strict adherence to cleanliness and dielectric testing standards to assure reliability
Fast Prototyping & Scalable Production
- Rapid prototyping services to validate your compute and network PCB designs
- Seamless transition from prototype to medium and large-scale production
- Global manufacturing capabilities with U.S. engineering oversight for quality assurance
Featured Resource: PCB Material Selection for AI and Data Center Applications
This whitepaper provides a structured framework for selecting PCB materials in high-speed data center applications, helping engineers align electrical performance, thermal reliability, manufacturability, and scalability requirements.
What the Whitepaper Includes
- Criteria for evaluating PCB materials in high-speed server and data center environments
- Guidance on matching material classes to channel length, speed, and system complexity
- A comparison matrix of standard FR-4, low-loss FR-4, ultra-low-loss thermosets, and PTFE-based materials
- Key electrical, thermal, and manufacturing properties that influence long-term reliability
- Best practices for documenting material callouts
Why Domestic PCB Manufacturing Matters for AI and Data Centers
AI infrastructure programs often involve compressed development cycles, security considerations, and high-visibility product launches. Domestic fabrication provides:
- Direct engineering communication
- Predictable lead times
- Secure supply chain support
- Rapid prototype iteration
Our U.S.-based facilities enable computing OEMs to move from development to production with greater visibility and control.
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Secure File Transfer
For AdvancedPCB to best represent and protect your data we ask for your compliance with the following:
- Please take measures to mark your unclassified information as CUI, in advance of sharing.
- When sharing information, we must transmit through a secured portal/file transfer protocol (FTP). We cannot transmit CUI information via email, only via secured portal.
- AdvancedPCB can use the customer provided secure portal.
- OR you can contact us to request a secure, temporary link for the Serv-U File Sharing platform. Once requested, you will receive an automated email containing the credentials necessary to securely upload your project files.