Manufacturing Capabilities
We are a comprehensive solutions provider for all your PCB needs. From design through final assembly, small batch to high volume, quick-turnaround to long-lead times, AdvancedPCB is your go-to printed circuit board partner. Our capabilities range from standard technology to the most advanced products in the world. The products we manufacturing include HDI, UDHI, RF/microwave PCBs, flex and rigid-flex circuits, SMT and through-hole assembly and design layout services. If you have any questions about our capabilities, please give us a call at 1-800-979-4722, reach out to one of our product specialists here or find your regional sales contact here.
Select a facility to view capabilities
Attributes
Standard
Advanced
Development (NPI)
Maximum Board Size
15x21
21x25
Maximum Panel Size
18x24
24x26
>24x26
Maximum Board Thickness
.250"
.320"
Minimum Board Thickness
0.002 flex
0.002 flex
0.002 flex
Overall Board Thickness Tolerance (+/- %)
10%
7%
5%
Warpage/ Bow and Twist capability - mils per Inch
0.0100
0.0075
0.0050
Maximum Rigid Layer Count
28
38
38+
Maximum Flex Layer Count
6
10
12+
Maximum Rigid-Flex Layer Count
14
24
30+
Minimum Core Thickness
.0005 Flex
.001 Flex
.0005 Flex
Minimum Dielectric Thickness
.0005 Flex
.001 Flex
.0005 Flex
Lam Cycles Rigid
3x
4x
>4
Lam Cycles Flex
2x
4x
>4
Lam Cycles Rigid-Flex
3x
4x
>4
Trace/Space - Base Copper Thickness
Inner Layer Width - 1/4 oz. Cu
0.0025
0.003
Inner Layer with - 1/2 oz Cu
0.0035
0.003
0.0025
Inner Layer Width - 1 oz. Cu
0.0045
0.0035
0.003
Inner Layer Width - 2 oz. Cu
0.006
0.0055
0.0045
Inner Layer Width - 3 oz. Cu
0.008
0.0075
0.006
Inner Layer Width - 4 oz. Cu
0.01
0.009
N/A
Inner Layer Space - Trace to Trace - 1/2 oz. Cu
0.0035
0.003
0.0025
Inner Layer Space - Trace to Trace - 1 oz. Cu
0.0045
0.0035
0.003
Inner Layer Space - Trace to Trace - 2 oz. Cu
0.006
0.0055
0.005
Inner Layer Space - Trace to Trace - 3 oz. Cu
0.008
0.0075
0.006
Inner Layer Space - Trace to Trace - 4 oz. Cu
0.01
0.009
N/A
Outer Layer Width - 1/4 & 3/8 oz. Cu. Base
0.003
0.0025
0.002
Outer Layer Width - 1/2 oz. Cu. Base
0.0045
0.003
0.0025
Outer Layer Width - 1 oz. Cu. Base
0.0055
0.004
0.003
Outer Layer Width - 2 oz. Cu. Base
0.007
0.0055
0.004
Outer Layer Width - 3 oz. Cu. Base
0.009
0.0075
0.006
Outer Layer Space - Trace to Trace - 1/4 & 3/8 oz. Cu. Base
0.003
0.0025
0.002
Outer Layer Space - Trace to Trace - 1/2 oz. Cu. Base
0.0035
0.003
0.0025
Outer Layer Space - Trace to Trace - 1 oz. Cu. Base
0.0055
0.004
0.003
Outer Layer Space - Trace to Trace - 2 oz. Cu. Base
0.007
0.0055
0.005
Outer Layer Space - Trace to Trace - 3 oz. Cu. Base
0.009
0.0075
0.006
Gold Body / Bi-Level Gold w/ 0.25oz foil
0.0035
0.003
Gold Body / Bi-Level Gold w/ 0.5oz foil
0.004
0.0035
Minimum Outer Layer Trace Widths for Boards With Filled and Plated Over Vias.
0.005
0.004
0.003
Minimum Outer Layer Spacing for Boards With Filled and Plated Over Vias.
.006
.005
.004
Etch Requirements
Minimum copper sliver between antipads
0.005
0.004
Etch Tolerance and factor 1/2 OZ Cu or less inner/outer NO VF
+/-.00075
+/-.0005
Etch Tolerance and factor 1/2 OZ Cu or less inner/outer w/ VF
+/-.0015
+/-.001
Etch Tolerance and factor 1 OZ Cu inner/outer NO VF
+/-.0015
+/-.001
Etch Tolerance and factor 2 OZ Cu inner/outer NO VF
+/-.002
+/-.0015
Etch Tolerance and factor 3 OZ Cu inner/outer NO VF
+/-.0025
+/-.002
Drill & Rout
Smallest PTH - Via HDI
Smallest Mechanical PTH - Via (aspect ratio driven)
0.0059
0.005
Smallest PTH - Component
0.015
0.012
PTH - Tolerance
+/-.003
+/-.002
+/-.0015
PTH - Tolerance Press Fit
+/-.0025
+/-.002
+/-.0015
NPTH - Tolerance
+/-.002
+/-.001
NPTH - Slot Tolerance
PTH - Slot Tolerance
Standard Rout Tolerances
+/-.005
+/-.004
+/-.003
Optical Rout Tolerances (Rout edge to feature location)
+/-.003
+/-.002
+/-.0015
Aspect Ratio - Plated Through Holes - > .020" drilled
10:1
12:1
14:1
Aspect Ratio - Plated Through Holes - .010"-.019" drilled
10:1
12:1
14:1
Minimum Drill to Copper for PTH
0.01
0.008
0.006
Minimum Drill to Copper for PTH Sub Asemblies
0.01
0.008
0.006
Minimum Drill to Copper for Laser uVias
0.006
0.005
Minimum hole to hole edge for PTH
0.012
0.01
0.008
Minimum hole to hole edge for Laser uVias
0.008
0.006
Drill/Pad Size - No Break Out - Thru drill.
nominal +.017
nominal + .015
Drill/Pad Size - No Break Out - HDI
nominal +.006
nomina + .005
Minimum Pad
0.015
0.01
0.008
Minimum Isolated Pad
0.015
0.01
0.008
Minimum Laser Drilled pad
0.012
0.01
0.008
SMT Pitch
0.01
0.008
0.006
Buried Vias - Mechanical Drill Minimum Size
0.008
0.006
0.004
Buried Vias - Mechanical Drill - Max Aspect Ratio
10:1
12:1
14:1
Blind Vias - Mechanical Drill Minimum
0.008
0.006
0.004
Blind Vias - Mechanical Drill - Max Aspect Ratio
10:1
12:1
14:1
Blind Vias - Laser Drilled. - Minimum Size
0.004
0.003
0.002
Blind Vias - Laser Drilled. - Maximum Size
0.007
0.008
0.009
Blind Vias - Laser Drilled. - Maximum Aspect Ratio.
0.5:1
0.75:1
1:1
Maximum Copper Fill Depth Micro uVias
0.004
0.005
0.006
Back Drill Depth Remaning Stub
0.01
0.008
0.006
Back Drill - Minimum Over Primary Drill Size (Oversize bit will depend on primary drill size)
0.012
0.01
0.008
Back Drill - Depth Tolerance
+/-.005
+/-.003
+/-.002
Min Back Drill Depth for filled & plated over BD holes
0.01
0.008
Drill True Position Tolerance Standard (+/-)
0.006
0.005
0.004
Drill True Position Tolerance w/ camera alignment (+/-)
0.003
0.002
0.001
Drill hole to hole positional tolerance (+/-)
0.003
0.0025
0.002
Minimum PTH Size That Can Be Filled With Non Conductive Material and Plated Over
0.0091
0.0078
Maximum PTH Size That Can Be Filled With Non Conductive Material and Plated Over
0.025
0.028
.0.038
Impedance
Impedance - Tolerance
+/-10%
+/-7%
+/-5%
Maximum Impedance - Value Ohms
100Ω
130Ω
Minimum Impedance - Value Ohms
28Ω
25Ω
Impedance Coupon Size
.5"x 6"
custom
Solder Mask & Silkscreen
Solder Mask Web width over laminate (i.e. between pads)
0.004
0.003
0.002
Solder Mask Web width over copper (i.e. over a trace)
0.003
0.002
0.002
Solder Mask Clearance to Pad(i.e. annular ring)
0.003
0.002
0.001
Minimum Silkscreen line width / height (white only)
4 mils / 15-20 mils
3 mils /15-20 mils
Standard Silkscreen line width / height
5 mils / 25-30 mils
N/A
Maximum Tented Via
0.016
0.02
Spacing & Registration
Minimum Copper spacing To Board Edge
.010
.008
.005
Minimum hole spacing To Board Edge
.010
.008
.005
Layer to Layer Registration - Different Cores
0.005
0.004
0.003
Outer layer feature True Position Tolerance
0.006
0.005
0.004
Front to Back Registration (Same Core)
.001"
0.0005"
HASL Pad to Pad Space & Pad Size (Ganged areas not doable for SC)
Premier PCBs Manufactured in the USA
AdvancedPCB is one of the few PCB suppliers that is able to manufacture PCBs to support government programs. Since we are not a broker, all of our printed circuit boards are manufactured in USA facilities with a broad range of advanced capabilities for high reliability, precision, and powerful PCB performance for critical applications.
Let’s Innovate Together
Our customer service and reliability is known as the very best in the industry, with quick turn capabilities (same day and weekend turns available) and a readiness to manufacture and assemble any size run of PCBs. Check out our free PCB Artist Software and DFM File Check tools or request a quote to get started today.