Manufacturing Capabilities

    We are a comprehensive solutions provider for all your PCB needs. From design through final assembly, small batch to high volume, quick-turnaround to long-lead times, AdvancedPCB is your go-to printed circuit board partner. Our capabilities range from standard technology to the most advanced products in the world. The products we manufacturing include HDI, UDHI, RF/microwave PCBs, flex and rigid-flex circuits, SMT and through-hole assembly and design layout services. If you have any questions about our capabilities, please give us a call at 1-800-979-4722, reach out to one of our product specialists here or find your regional sales contact here.

    View list of capabilities by facility

    Select a facility to view capabilities

    Maximum Board Size
    16x22
    Maximum Panel Size
    18x24
    Maximum Board Thickness
    0.125
    0.155
    Minimum Board Thickness
    0.031
    0.01
    Overall Board Thickness Tolerance (+/- %)
    10%
    Warpage/ Bow and Twist capability - mils per Inch
    0.0100
    0.0750
    Maximum Rigid Layer Count
    18
    24
    Maximum Flex Layer Count
    Maximum Rigid-Flex Layer Count
    Minimum Core Thickness
    0.003
    Minimum Dielectric Thickness
    0.003
    Lam Cycles Rigid
    Lam Cycles Flex
    Lam Cycles Rigid-Flex
    Trace/Space - Base Copper Thickness
    Inner Layer Width - 1/4 oz. Cu
    Inner Layer with - 1/2 oz Cu
    0.003
    Inner Layer Width - 1 oz. Cu
    0.004
    Inner Layer Width - 2 oz. Cu
    0.005
    Inner Layer Width - 3 oz. Cu
    0.008
    Inner Layer Width - 4 oz. Cu
    0.012
    0.01
    Inner Layer Space - Trace to Trace - 1/2 oz. Cu
    0.003
    Inner Layer Space - Trace to Trace - 1 oz. Cu
    0.004
    Inner Layer Space - Trace to Trace - 2 oz. Cu
    0.005
    Inner Layer Space - Trace to Trace - 3 oz. Cu
    0.008
    Inner Layer Space - Trace to Trace - 4 oz. Cu
    0.012
    0.01
    Outer Layer Width - 1/4 & 3/8 oz. Cu. Base
    0.003
    Outer Layer Width - 1/2 oz. Cu. Base
    0.004
    Outer Layer Width - 1 oz. Cu. Base
    0.005
    Outer Layer Width - 2 oz. Cu. Base
    0.008
    Outer Layer Width - 3 oz. Cu. Base
    0.012
    0.01
    Outer Layer Space - Trace to Trace - 1/4 & 3/8 oz. Cu. Base
    0.003
    Outer Layer Space - Trace to Trace - 1/2 oz. Cu. Base
    0.004
    Outer Layer Space - Trace to Trace - 1 oz. Cu. Base
    0.005
    Outer Layer Space - Trace to Trace - 2 oz. Cu. Base
    0.008
    Outer Layer Space - Trace to Trace - 3 oz. Cu. Base
    0.012
    0.01
    Gold Body / Bi-Level Gold w/ 0.25oz foil
    Gold Body / Bi-Level Gold w/ 0.5oz foil
    0.004
    Minimum Outer Layer Trace Widths for Boards With Filled and Plated Over Vias.
    0.005
    0.003
    Minimum Outer Layer Spacing for Boards With Filled and Plated Over Vias.
    0.005
    0.003
    Etch Requirements
    Minimum copper sliver between antipads
    0.005
    0.004
    Etch Tolerance and factor 1/2 OZ Cu or less inner/outer NO VF
    +/-.002
    +/-.001
    Etch Tolerance and factor 1/2 OZ Cu or less inner/outer w/ VF
    +/-.002
    +/-.001
    Etch Tolerance and factor 1 OZ Cu inner/outer NO VF
    +/-.002
    +/-.001
    Etch Tolerance and factor 2 OZ Cu inner/outer NO VF
    +/-.002
    +/-.0016
    Etch Tolerance and factor 3 OZ Cu inner/outer NO VF
    +/-.003
    +/-.0024
    Drill & Rout
    Smallest PTH - Via HDI
    Smallest Mechanical PTH - Via (aspect ratio driven)
    0.006
    0.004
    Smallest PTH - Component
    0.015
    PTH - Tolerance
    0.003
    0.002
    PTH - Tolerance Press Fit
    0.003
    0.002
    NPTH - Tolerance
    0.002
    0.002
    NPTH - Slot Tolerance
    +/-0.005
    +/-0.003
    PTH - Slot Tolerance
    +/-0.005
    +/-0.003
    Standard Rout Tolerances
    +/-0.005
    +/-0.003
    Optical Rout Tolerances (Rout edge to feature location)
    Aspect Ratio - Plated Through Holes - > .020" drilled
    10:1
    Aspect Ratio - Plated Through Holes - .010"-.019" drilled
    10:1
    Minimum Drill to Copper for PTH
    0.01
    0.008
    Minimum Drill to Copper for PTH Sub Asemblies
    Minimum Drill to Copper for Laser uVias
    Minimum hole to hole edge for PTH
    0.01
    Minimum hole to hole edge for Laser uVias
    Drill/Pad Size - No Break Out - Thru drill.
    nominal + .01
    Drill/Pad Size - No Break Out - HDI
    Minimum Pad
    0.015
    Minimum Isolated Pad
    Minimum Laser Drilled pad
    SMT Pitch
    0.01
    Buried Vias - Mechanical Drill Minimum Size
    Buried Vias - Mechanical Drill - Max Aspect Ratio
    Blind Vias - Mechanical Drill Minimum
    Blind Vias - Mechanical Drill - Max Aspect Ratio
    Blind Vias - Laser Drilled. - Minimum Size
    Blind Vias - Laser Drilled. - Maximum Size
    Blind Vias - Laser Drilled. - Maximum Aspect Ratio.
    Maximum Copper Fill Depth Micro uVias
    Back Drill Depth Remaning Stub
    Back Drill - Minimum Over Primary Drill Size (Oversize bit will depend on primary drill size)
    Back Drill - Depth Tolerance
    Min Back Drill Depth for filled & plated over BD holes
    Drill True Position Tolerance Standard (+/-)
    0.005
    0.004
    Drill True Position Tolerance w/ camera alignment (+/-)
    Drill hole to hole positional tolerance (+/-)
    0.003
    0.002
    Minimum PTH Size That Can Be Filled With Non Conductive Material and Plated Over
    0.008
    .004 or 10:1 aspect ratio
    Maximum PTH Size That Can Be Filled With Non Conductive Material and Plated Over
    0.018
    2:1 aspect ratio
    Impedance
    Impedance - Tolerance
    +/-10%
    +/-5%
    Maximum Impedance - Value Ohms
    120Ω
    Minimum Impedance - Value Ohms
    35Ω
    Impedance Coupon Size
    8"x1" (varies)
    Solder Mask & Silkscreen
    Solder Mask Web width over laminate (i.e. between pads)
    0.004
    0.003
    Solder Mask Web width over copper (i.e. over a trace)
    0.004
    0.003
    Solder Mask Clearance to Pad(i.e. annular ring)
    0.002
    Minimum Silkscreen line width / height (white only)
    0.005
    0.003
    Standard Silkscreen line width / height
    0.005
    Maximum Tented Via
    0.018
    Spacing & Registration
    Minimum Copper spacing To Board Edge
    0.01
    Minimum hole spacing To Board Edge
    0.01
    Layer to Layer Registration - Different Cores
    -
    0.003
    Outer layer feature True Position Tolerance
    0.001
    Front to Back Registration (Same Core)
    0.006
    0.005
    HASL Pad to Pad Space & Pad Size (Ganged areas not doable for SC)

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Manufactured in the USA

    AdvancedPCB is one of the few PCB suppliers that is able to manufacture PCBs to support government programs. Since we are not a broker, all of our printed circuit boards are manufactured in USA facilities with a broad range of advanced capabilities for high reliability, precision, and powerful PCB performance for critical applications.

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    Our customer service and reliability is known as the very best in the industry, with  quick turn capabilities (same day and weekend turns available) and a readiness to manufacture and assemble any size run of PCBs. Check out our free PCB Artist Software and DFM File Check tools or request a quote to get started today.

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    Get In Touch Today

    Please contact us at 1-800-979-4722, find your regional sales contact here or use the form below to reach out to AdvancedPCB and ask one of our many highly trained team members a question about our design, manufacturing and assembly capabilities.

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