Manufacturing Capabilities
We are a comprehensive solutions provider for all your PCB needs. From design through final assembly, small batch to high volume, quick-turnaround to long-lead times, AdvancedPCB is your go-to printed circuit board partner. Our capabilities range from standard technology to the most advanced products in the world. The products we manufacturing include HDI, UDHI, RF/microwave PCBs, flex and rigid-flex circuits, SMT and through-hole assembly and design layout services. If you have any questions about our capabilities, please give us a call at 1-800-979-4722, reach out to one of our product specialists here or find your regional sales contact here.
Select a facility to view capabilities
Attributes
Standard
Advanced
Development (NPI)
Maximum Board Size
14x20
15x21
16x22
Maximum Panel Size
18x24
21x24
Maximum Board Thickness
0.19
0.20
˃.200
Minimum Board Thickness
0.01
0.008
≤.007
Overall Board Thickness Tolerance (+/- %)
10%
8%
6%
Warpage/ Bow and Twist capability - mils per Inch
0.0100
0.0075
0.0050
Maximum Rigid Layer Count
24
26-30
32+
Maximum Flex Layer Count
Maximum Rigid-Flex Layer Count
Minimum Core Thickness
0.002
0.001
0.001 Flex
Minimum Dielectric Thickness
0.002
0.001
.001 Flex
Lam Cycles Rigid
3x
5x
8x
Lam Cycles Flex
N/A
N/A
N/A
Lam Cycles Rigid-Flex
N/A
N/A
N/A
Trace/Space - Base Copper Thickness
Inner Layer Width - 1/4 oz. Cu
0.0025
0.003
Inner Layer with - 1/2 oz Cu
0.0035
0.003
0.00275
Inner Layer Width - 1 oz. Cu
0.0045
0.0035
0.003
Inner Layer Width - 2 oz. Cu
0.006
0.0055
0.005
Inner Layer Width - 3 oz. Cu
0.008
0.0075
0.007
Inner Layer Width - 4 oz. Cu
0.01
0.009
0.0085
Inner Layer Space - Trace to Trace - 1/2 oz. Cu
0.0035
0.003
0.00275
Inner Layer Space - Trace to Trace - 1 oz. Cu
0.0045
0.004
0.0035
Inner Layer Space - Trace to Trace - 2 oz. Cu
0.006
0.0055
0.005
Inner Layer Space - Trace to Trace - 3 oz. Cu
0.008
0.0075
0.007
Inner Layer Space - Trace to Trace - 4 oz. Cu
0.01
0.009
0.008
Outer Layer Width - 1/4 & 3/8 oz. Cu. Base
0.0035
0.003
0.00275
Outer Layer Width - 1/2 oz. Cu. Base
0.0045
0.0035
0.003
Outer Layer Width - 1 oz. Cu. Base
0.0055
0.004
0.003
Outer Layer Width - 2 oz. Cu. Base
0.01
0.006
0.005
Outer Layer Width - 3 oz. Cu. Base
0.009
0.0075
0.007
Outer Layer Space - Trace to Trace - 1/4 & 3/8 oz. Cu. Base
0.0035
0.003
0.00275
Outer Layer Space - Trace to Trace - 1/2 oz. Cu. Base
0.004
0.0035
0.003
Outer Layer Space - Trace to Trace - 1 oz. Cu. Base
0.0055
0.0045
0.0035
Outer Layer Space - Trace to Trace - 2 oz. Cu. Base
0.007
0.0065
0.006
Outer Layer Space - Trace to Trace - 3 oz. Cu. Base
0.009
0.008
0.007
Gold Body / Bi-Level Gold w/ 0.25oz foil
Gold Body / Bi-Level Gold w/ 0.5oz foil
Minimum Outer Layer Trace Widths for Boards With Filled and Plated Over Vias.
0.005
0.004
0.0035
Minimum Outer Layer Spacing for Boards With Filled and Plated Over Vias.
0.006
0.005
0.0045
Etch Requirements
Minimum copper sliver between antipads
0.005
0.004
Etch Tolerance and factor 1/2 OZ Cu or less inner/outer NO VF
+/-.00075
+/-.0005
Etch Tolerance and factor 1/2 OZ Cu or less inner/outer w/ VF
+/-.0015
+/-.001
Etch Tolerance and factor 1 OZ Cu inner/outer NO VF
+/-.0015
+/-.001
Etch Tolerance and factor 2 OZ Cu inner/outer NO VF
+/-.002
+/-.0015
Etch Tolerance and factor 3 OZ Cu inner/outer NO VF
+/-.0025
+/-.002
Drill & Rout
Smallest PTH - Via HDI
0.006
0.005
≤.004
Smallest Mechanical PTH - Via (aspect ratio driven)
0.0059
0.005
Smallest PTH - Component
0.015
PTH - Tolerance
0.003
0.002
0.0015
PTH - Tolerance Press Fit
0.0025
0.002
0.0015
NPTH - Tolerance
0.002
0.001
NPTH - Slot Tolerance
+/-.004
+/- .003
+/-.002
PTH - Slot Tolerance
+/-.005
+/-.004
+/-.003
Standard Rout Tolerances
+/-.005
+/-.004
+/-.003
Optical Rout Tolerances (Rout edge to feature location)
0.004
0.003
Aspect Ratio - Plated Through Holes - > .020" drilled
10:1
13:1
16:1
Aspect Ratio - Plated Through Holes - .010"-.019" drilled
10:1
13:1
16:1
Minimum Drill to Copper for PTH
0.01
0.008
0.007
Minimum Drill to Copper for PTH Sub Asemblies
0.008
0.007
Minimum Drill to Copper for Laser uVias
0.006
0.0025
0.002
Minimum hole to hole edge for PTH
0.012
0.01
0.008
Minimum hole to hole edge for Laser uVias
0.008
0.005
≤.005
Drill/Pad Size - No Break Out - Thru drill.
nominal +.014
nominal + .012
Drill/Pad Size - No Break Out - HDI
nominal +.006
nominal + .005
Minimum Pad
0.01
0.008
0.008
Minimum Isolated Pad
0.012
0.01
0.008
Minimum Laser Drilled pad
0.012
0.01
0.008
SMT Pitch
0.016
Buried Vias - Mechanical Drill Minimum Size
0.0079
0.0059
Buried Vias - Mechanical Drill - Max Aspect Ratio
10:1
12:1
14:1
Blind Vias - Mechanical Drill Minimum
0.0079
0.0059
Blind Vias - Mechanical Drill - Max Aspect Ratio
10:01
12:01
14:01
Blind Vias - Laser Drilled. - Minimum Size
0.006
0.0055
Blind Vias - Laser Drilled. - Maximum Size
0.007
0.008
0.009
Blind Vias - Laser Drilled. - Maximum Aspect Ratio.
.5:1
0.75:1
.85:1
Maximum Copper Fill Depth Micro uVias
0.003
0.004
0.006
Back Drill Depth Remaning Stub
0.01
0.008
0.006
Back Drill - Minimum Over Primary Drill Size (Oversize bit will depend on primary drill size)
0.01
0.009
0.008
Back Drill - Depth Tolerance
+/-.005
+/-.003
+/-.002
Min Back Drill Depth for filled & plated over BD holes
0.01
0.009
Drill True Position Tolerance Standard (+/-)
0.003
0.002
Drill True Position Tolerance w/ camera alignment (+/-)
0.002
0.0018
Drill hole to hole positional tolerance (+/-)
0.003
0.002
Minimum PTH Size That Can Be Filled With Non Conductive Material and Plated Over
0.0098
0.0079
Maximum PTH Size That Can Be Filled With Non Conductive Material and Plated Over
0.035
0.04
Impedance
Impedance - Tolerance
+/-10%
+/-8%
+/-5%
Maximum Impedance - Value Ohms
100Ω
110Ω
Minimum Impedance - Value Ohms
50Ω
40Ω
Impedance Coupon Size
.5"x 6"
custom
Solder Mask & Silkscreen
Solder Mask Web width over laminate (i.e. between pads)
0.004
0.0035
0.003
Solder Mask Web width over copper (i.e. over a trace)
0.004
0.0035
0.003
Solder Mask Clearance to Pad(i.e. annular ring)
0.003
0.002
0.0015
Minimum Silkscreen line width / height (white only)
4 mils / 15-20 mils
3 mils /15-20 mils
N/A
Standard Silkscreen line width / height
5 mils / 25-30 mils
Maximum Tented Via
0.016
0.02
Spacing & Registration
Minimum Copper spacing To Board Edge
0.01
0.008
0.005
Minimum hole spacing To Board Edge
0.01
0.008
0.005
Layer to Layer Registration - Different Cores
.003
0.002
Outer layer feature True Position Tolerance
20%
15%
Front to Back Registration (Same Core)
0.002
0.0015
HASL Pad to Pad Space & Pad Size (Ganged areas not doable for SC)
0.006
0.005
Premier PCBs Manufactured in the USA
AdvancedPCB is one of the few PCB suppliers that is able to manufacture PCBs to support government programs. Since we are not a broker, all of our printed circuit boards are manufactured in USA facilities with a broad range of advanced capabilities for high reliability, precision, and powerful PCB performance for critical applications.
Let’s Innovate Together
Our customer service and reliability is known as the very best in the industry, with quick turn capabilities (same day and weekend turns available) and a readiness to manufacture and assemble any size run of PCBs. Check out our free PCB Artist Software and DFM File Check tools or request a quote to get started today.