AdvancedPCB
APCT Advanced Circuits San Diego PCB Design
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Manufacturing Capabilities

    We are a comprehensive solutions provider for all your PCB needs. From design through final assembly, small batch to high volume, quick-turnaround to long-lead times, AdvancedPCB is your go-to printed circuit board partner. Our capabilities range from standard technology to the most advanced products in the world. The products we manufacturing include HDI, UDHI, RF/microwave PCBs, flex and rigid-flex circuits, SMT and through-hole assembly and design layout services. If you have any questions about our capabilities, please give us a call at 1-800-979-4722, reach out to one of our product specialists here or find your regional sales contact here.

    View list of capabilities by facility

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    Attributes
    Standard
    Advanced
    Development (NPI)
    Maximum Board Size
    16x22
    19x22
    Maximum Panel Size
    18 x 24
    21x24, 20x26
    N/A
    Maximum Board Thickness
    0.25
    Minimum Board Thickness
    0.01
    0.008
    Overall Board Thickness Tolerance (+/- %)
    10%
    7%
    5%
    Warpage/ Bow and Twist capability - mils per Inch
    0.0100
    0.0075
    0.0050
    Maximum Rigid Layer Count
    28
    42
    42+
    Maximum Flex Layer Count
    Maximum Rigid-Flex Layer Count
    Minimum Core Thickness
    0.002
    0.001
    0.0005
    Minimum Dielectric Thickness
    0.002
    0.001
    Lam Cycles Rigid
    5x
    7x
    9X
    Lam Cycles Flex
    N/A
    N/A
    Lam Cycles Rigid-Flex
    N/A
    N/A
    Maximum Board Size
    16x22
    18x22
    N/A
    Maximum Panel Size
    18x24
    21x24
    N/A
    Maximum Board Thickness
    0.125
    0.25
    N/A
    Minimum Board Thickness
    0.01
    0.008
    0.005
    Overall Board Thickness Tolerance (+/- %)
    10%
    7%
    5%
    Warpage/ Bow and Twist capability - mils per Inch
    0.0075
    0.0060
    0.0050
    Maximum Rigid Layer Count
    < 20
    38
    >40
    Maximum Flex Layer Count
    Maximum Rigid-Flex Layer Count
    Minimum Core Thickness
    0.002
    Minimum Dielectric Thickness
    0.003
    0.002
    0.0015
    Lam Cycles Rigid
    4X
    6X
    >6
    Lam Cycles Flex
    N/A
    N/A
    N/A
    Lam Cycles Rigid-Flex
    N/A
    N/A
    N/A
    Maximum Board Size
    14x20
    15x21
    16x22
    Maximum Panel Size
    18x24
    21x24
    Maximum Board Thickness
    0.19
    0.20
    ˃.200
    Minimum Board Thickness
    0.01
    0.008
    ≤.007
    Overall Board Thickness Tolerance (+/- %)
    10%
    8%
    6%
    Warpage/ Bow and Twist capability - mils per Inch
    0.0100
    0.0075
    0.0050
    Maximum Rigid Layer Count
    24
    26-30
    32+
    Maximum Flex Layer Count
    Maximum Rigid-Flex Layer Count
    Minimum Core Thickness
    0.002
    0.001
    0.001 Flex
    Minimum Dielectric Thickness
    0.002
    0.001
    .001 Flex
    Lam Cycles Rigid
    3x
    5x
    8x
    Lam Cycles Flex
    N/A
    N/A
    N/A
    Lam Cycles Rigid-Flex
    N/A
    N/A
    N/A
    Maximum Board Size
    15x21
    21x25
    Maximum Panel Size
    18x24
    24x26
    >24x26
    Maximum Board Thickness
    .250"
    .320"
    Minimum Board Thickness
    0.002 flex
    0.002 flex
    0.002 flex
    Overall Board Thickness Tolerance (+/- %)
    10%
    7%
    5%
    Warpage/ Bow and Twist capability - mils per Inch
    0.0100
    0.0075
    0.0050
    Maximum Rigid Layer Count
    28
    38
    38+
    Maximum Flex Layer Count
    6
    10
    12+
    Maximum Rigid-Flex Layer Count
    14
    24
    30+
    Minimum Core Thickness
    .0005 Flex
    .001 Flex
    .0005 Flex
    Minimum Dielectric Thickness
    .0005 Flex
    .001 Flex
    .0005 Flex
    Lam Cycles Rigid
    3x
    4x
    >4
    Lam Cycles Flex
    2x
    4x
    >4
    Lam Cycles Rigid-Flex
    3x
    4x
    >4
    Maximum Board Size
    16 x 22
    16 x 52, 22 x 28
    Maximum Panel Size
    18 x 24
    18 x 54, 24 x 30
    36 x 119 DS
    Maximum Board Thickness
    0.25
    Minimum Board Thickness
    .010 Rigid
    .008 Rigid
    .006 Rigid
    Overall Board Thickness Tolerance (+/- %)
    10%
    7%
    5%
    Warpage/ Bow and Twist capability - mils per Inch
    0.0100
    0.0075
    0.0050
    Maximum Rigid Layer Count
    26
    40
    40 +
    Maximum Flex Layer Count
    N/A
    N/A
    N/A
    Maximum Rigid-Flex Layer Count
    N/A
    N/A
    N/A
    Minimum Core Thickness
    0.004
    0.002
    0.0010
    Minimum Dielectric Thickness
    0.002
    0.001
    N/A
    Lam Cycles Rigid
    3x
    6x
    >6x
    Lam Cycles Flex
    N/A
    N/A
    N/A
    Lam Cycles Rigid-Flex
    N/A
    N/A
    N/A
    Maximum Board Size
    16x22
    Maximum Panel Size
    18x24
    Maximum Board Thickness
    0.125
    0.155
    Minimum Board Thickness
    0.031
    0.01
    Overall Board Thickness Tolerance (+/- %)
    10%
    Warpage/ Bow and Twist capability - mils per Inch
    0.0100
    0.0750
    Maximum Rigid Layer Count
    18
    24
    Maximum Flex Layer Count
    Maximum Rigid-Flex Layer Count
    Minimum Core Thickness
    0.003
    Minimum Dielectric Thickness
    0.003
    Lam Cycles Rigid
    Lam Cycles Flex
    Lam Cycles Rigid-Flex
    Trace/Space - Base Copper Thickness
    Inner Layer Width - 1/4 oz. Cu
    0.0025
    0.003
    Inner Layer with - 1/2 oz Cu
    0.0035
    0.0025
    0.002
    Inner Layer Width - 1 oz. Cu
    0.0045
    0.0035
    0.003
    Inner Layer Width - 2 oz. Cu
    0.006
    0.0055
    0.004
    Inner Layer Width - 3 oz. Cu
    0.008
    0.0075
    0.006
    Inner Layer Width - 4 oz. Cu
    0.01
    0.009
    N/A
    Inner Layer Space - Trace to Trace - 1/2 oz. Cu
    0.0035
    0.0025
    0.002
    Inner Layer Space - Trace to Trace - 1 oz. Cu
    0.0045
    0.004
    0.003
    Inner Layer Space - Trace to Trace - 2 oz. Cu
    0.006
    0.0055
    0.005
    Inner Layer Space - Trace to Trace - 3 oz. Cu
    0.008
    0.0075
    0.006
    Inner Layer Space - Trace to Trace - 4 oz. Cu
    0.01
    0.009
    N/A
    Outer Layer Width - 1/4 & 3/8 oz. Cu. Base
    0.003
    0.002
    0.0015
    Outer Layer Width - 1/2 oz. Cu. Base
    0.0045
    0.003
    0.0022
    Outer Layer Width - 1 oz. Cu. Base
    0.0055
    0.004
    0.003
    Outer Layer Width - 2 oz. Cu. Base
    0.007
    0.0055
    0.004
    Outer Layer Width - 3 oz. Cu. Base
    0.009
    0.0075
    0.006
    Outer Layer Space - Trace to Trace - 1/4 & 3/8 oz. Cu. Base
    0.003
    0.002
    0.0015
    Outer Layer Space - Trace to Trace - 1/2 oz. Cu. Base
    0.003
    0.0025
    0.0022
    Outer Layer Space - Trace to Trace - 1 oz. Cu. Base
    0.0055
    0.004
    0.003
    Outer Layer Space - Trace to Trace - 2 oz. Cu. Base
    0.007
    0.0055
    0.005
    Outer Layer Space - Trace to Trace - 3 oz. Cu. Base
    0.009
    0.0075
    0.006
    Gold Body / Bi-Level Gold w/ 0.25oz foil
    0.0035
    0.003
    Gold Body / Bi-Level Gold w/ 0.5oz foil
    0.004
    0.0035
    Minimum Outer Layer Trace Widths for Boards With Filled and Plated Over Vias.
    0.005
    0.004
    0.003
    Minimum Outer Layer Spacing for Boards With Filled and Plated Over Vias.
    0.006
    0.005
    0.004
    Inner Layer Width - 1/4 oz. Cu
    0.0025
    0.002
    0.0015
    Inner Layer with - 1/2 oz Cu
    0.003
    0.0025
    0.002
    Inner Layer Width - 1 oz. Cu
    0.004
    0.0035
    0.003
    Inner Layer Width - 2 oz. Cu
    0.006
    0.0055
    0.005
    Inner Layer Width - 3 oz. Cu
    0.008
    0.0075
    0.007
    Inner Layer Width - 4 oz. Cu
    0.01
    0.009
    Inner Layer Space - Trace to Trace - 1/2 oz. Cu
    0.003
    0.003
    0.00275
    Inner Layer Space - Trace to Trace - 1 oz. Cu
    0.005
    0.004
    0.0035
    Inner Layer Space - Trace to Trace - 2 oz. Cu
    0.006
    0.005
    0.00475
    Inner Layer Space - Trace to Trace - 3 oz. Cu
    0.008
    0.0075
    0.007
    Inner Layer Space - Trace to Trace - 4 oz. Cu
    0.01
    0.009
    Outer Layer Width - 1/4 & 3/8 oz. Cu. Base
    0.003
    0.0025
    0.002
    Outer Layer Width - 1/2 oz. Cu. Base
    0.0035
    0.003
    0.0025
    Outer Layer Width - 1 oz. Cu. Base
    0.005
    0.004
    0.003
    Outer Layer Width - 2 oz. Cu. Base
    0.007
    0.006
    0.0055
    Outer Layer Width - 3 oz. Cu. Base
    0.009
    0.008
    n/a
    Outer Layer Space - Trace to Trace - 1/4 & 3/8 oz. Cu. Base
    0.003
    0.00275
    0.0025
    Outer Layer Space - Trace to Trace - 1/2 oz. Cu. Base
    0.00375
    0.0035
    0.00325
    Outer Layer Space - Trace to Trace - 1 oz. Cu. Base
    0.006
    0.0055
    0.005
    Outer Layer Space - Trace to Trace - 2 oz. Cu. Base
    0.007
    0.006
    Outer Layer Space - Trace to Trace - 3 oz. Cu. Base
    0.009
    0.008
    Gold Body / Bi-Level Gold w/ 0.25oz foil
    0.004
    0.0035
    Gold Body / Bi-Level Gold w/ 0.5oz foil
    0.0045
    0.004
    Minimum Outer Layer Trace Widths for Boards With Filled and Plated Over Vias.
    0.005
    0.004
    0.003
    Minimum Outer Layer Spacing for Boards With Filled and Plated Over Vias.
    0.006
    0.005
    0.004
    Inner Layer Width - 1/4 oz. Cu
    0.0025
    0.003
    Inner Layer with - 1/2 oz Cu
    0.0035
    0.003
    0.00275
    Inner Layer Width - 1 oz. Cu
    0.0045
    0.0035
    0.003
    Inner Layer Width - 2 oz. Cu
    0.006
    0.0055
    0.005
    Inner Layer Width - 3 oz. Cu
    0.008
    0.0075
    0.007
    Inner Layer Width - 4 oz. Cu
    0.01
    0.009
    0.0085
    Inner Layer Space - Trace to Trace - 1/2 oz. Cu
    0.0035
    0.003
    0.00275
    Inner Layer Space - Trace to Trace - 1 oz. Cu
    0.0045
    0.004
    0.0035
    Inner Layer Space - Trace to Trace - 2 oz. Cu
    0.006
    0.0055
    0.005
    Inner Layer Space - Trace to Trace - 3 oz. Cu
    0.008
    0.0075
    0.007
    Inner Layer Space - Trace to Trace - 4 oz. Cu
    0.01
    0.009
    0.008
    Outer Layer Width - 1/4 & 3/8 oz. Cu. Base
    0.0035
    0.003
    0.00275
    Outer Layer Width - 1/2 oz. Cu. Base
    0.0045
    0.0035
    0.003
    Outer Layer Width - 1 oz. Cu. Base
    0.0055
    0.004
    0.003
    Outer Layer Width - 2 oz. Cu. Base
    0.01
    0.006
    0.005
    Outer Layer Width - 3 oz. Cu. Base
    0.009
    0.0075
    0.007
    Outer Layer Space - Trace to Trace - 1/4 & 3/8 oz. Cu. Base
    0.0035
    0.003
    0.00275
    Outer Layer Space - Trace to Trace - 1/2 oz. Cu. Base
    0.004
    0.0035
    0.003
    Outer Layer Space - Trace to Trace - 1 oz. Cu. Base
    0.0055
    0.0045
    0.0035
    Outer Layer Space - Trace to Trace - 2 oz. Cu. Base
    0.007
    0.0065
    0.006
    Outer Layer Space - Trace to Trace - 3 oz. Cu. Base
    0.009
    0.008
    0.007
    Gold Body / Bi-Level Gold w/ 0.25oz foil
    Gold Body / Bi-Level Gold w/ 0.5oz foil
    Minimum Outer Layer Trace Widths for Boards With Filled and Plated Over Vias.
    0.005
    0.004
    0.0035
    Minimum Outer Layer Spacing for Boards With Filled and Plated Over Vias.
    0.006
    0.005
    0.0045
    Inner Layer Width - 1/4 oz. Cu
    0.0025
    0.003
    Inner Layer with - 1/2 oz Cu
    0.0035
    0.003
    0.0025
    Inner Layer Width - 1 oz. Cu
    0.0045
    0.0035
    0.003
    Inner Layer Width - 2 oz. Cu
    0.006
    0.0055
    0.0045
    Inner Layer Width - 3 oz. Cu
    0.008
    0.0075
    0.006
    Inner Layer Width - 4 oz. Cu
    0.01
    0.009
    N/A
    Inner Layer Space - Trace to Trace - 1/2 oz. Cu
    0.0035
    0.003
    0.0025
    Inner Layer Space - Trace to Trace - 1 oz. Cu
    0.0045
    0.0035
    0.003
    Inner Layer Space - Trace to Trace - 2 oz. Cu
    0.006
    0.0055
    0.005
    Inner Layer Space - Trace to Trace - 3 oz. Cu
    0.008
    0.0075
    0.006
    Inner Layer Space - Trace to Trace - 4 oz. Cu
    0.01
    0.009
    N/A
    Outer Layer Width - 1/4 & 3/8 oz. Cu. Base
    0.003
    0.0025
    0.002
    Outer Layer Width - 1/2 oz. Cu. Base
    0.0045
    0.003
    0.0025
    Outer Layer Width - 1 oz. Cu. Base
    0.0055
    0.004
    0.003
    Outer Layer Width - 2 oz. Cu. Base
    0.007
    0.0055
    0.004
    Outer Layer Width - 3 oz. Cu. Base
    0.009
    0.0075
    0.006
    Outer Layer Space - Trace to Trace - 1/4 & 3/8 oz. Cu. Base
    0.003
    0.0025
    0.002
    Outer Layer Space - Trace to Trace - 1/2 oz. Cu. Base
    0.0035
    0.003
    0.0025
    Outer Layer Space - Trace to Trace - 1 oz. Cu. Base
    0.0055
    0.004
    0.003
    Outer Layer Space - Trace to Trace - 2 oz. Cu. Base
    0.007
    0.0055
    0.005
    Outer Layer Space - Trace to Trace - 3 oz. Cu. Base
    0.009
    0.0075
    0.006
    Gold Body / Bi-Level Gold w/ 0.25oz foil
    0.0035
    0.003
    Gold Body / Bi-Level Gold w/ 0.5oz foil
    0.004
    0.0035
    Minimum Outer Layer Trace Widths for Boards With Filled and Plated Over Vias.
    0.005
    0.004
    0.003
    Minimum Outer Layer Spacing for Boards With Filled and Plated Over Vias.
    .006
    .005
    .004
    Inner Layer Width - 1/4 oz. Cu
    Inner Layer with - 1/2 oz Cu
    0.003
    0.0025
    -
    Inner Layer Width - 1 oz. Cu
    0.004
    0.0035
    Inner Layer Width - 2 oz. Cu
    0.006
    0.0055
    -
    Inner Layer Width - 3 oz. Cu
    0.008
    0.007
    Inner Layer Width - 4 oz. Cu
    0.01
    0.009
    Inner Layer Space - Trace to Trace - 1/2 oz. Cu
    0.003
    0.0025
    Inner Layer Space - Trace to Trace - 1 oz. Cu
    0.004
    0.004
    Inner Layer Space - Trace to Trace - 2 oz. Cu
    0.007
    0.006
    Inner Layer Space - Trace to Trace - 3 oz. Cu
    0.01
    0.009
    Inner Layer Space - Trace to Trace - 4 oz. Cu
    0.013
    0.012
    Outer Layer Width - 1/4 & 3/8 oz. Cu. Base
    0.003
    0.0025
    Outer Layer Width - 1/2 oz. Cu. Base
    0.003
    0.0025
    Outer Layer Width - 1 oz. Cu. Base
    0.004
    0.004
    Outer Layer Width - 2 oz. Cu. Base
    0.005
    0.005
    Outer Layer Width - 3 oz. Cu. Base
    0.008
    0.008
    Outer Layer Space - Trace to Trace - 1/4 & 3/8 oz. Cu. Base
    0.003
    0.0025
    Outer Layer Space - Trace to Trace - 1/2 oz. Cu. Base
    0.003
    0.0025
    Outer Layer Space - Trace to Trace - 1 oz. Cu. Base
    0.005
    0.004
    Outer Layer Space - Trace to Trace - 2 oz. Cu. Base
    0.007
    0.006
    Outer Layer Space - Trace to Trace - 3 oz. Cu. Base
    0.008
    0.007
    Gold Body / Bi-Level Gold w/ 0.25oz foil
    0.0035
    0.003
    Gold Body / Bi-Level Gold w/ 0.5oz foil
    0.004
    0.0035
    Minimum Outer Layer Trace Widths for Boards With Filled and Plated Over Vias.
    0.004
    0.0035
    Minimum Outer Layer Spacing for Boards With Filled and Plated Over Vias.
    0.004
    0.0035
    Inner Layer Width - 1/4 oz. Cu
    Inner Layer with - 1/2 oz Cu
    0.003
    Inner Layer Width - 1 oz. Cu
    0.004
    Inner Layer Width - 2 oz. Cu
    0.005
    Inner Layer Width - 3 oz. Cu
    0.008
    Inner Layer Width - 4 oz. Cu
    0.012
    0.01
    Inner Layer Space - Trace to Trace - 1/2 oz. Cu
    0.003
    Inner Layer Space - Trace to Trace - 1 oz. Cu
    0.004
    Inner Layer Space - Trace to Trace - 2 oz. Cu
    0.005
    Inner Layer Space - Trace to Trace - 3 oz. Cu
    0.008
    Inner Layer Space - Trace to Trace - 4 oz. Cu
    0.012
    0.01
    Outer Layer Width - 1/4 & 3/8 oz. Cu. Base
    0.003
    Outer Layer Width - 1/2 oz. Cu. Base
    0.004
    Outer Layer Width - 1 oz. Cu. Base
    0.005
    Outer Layer Width - 2 oz. Cu. Base
    0.008
    Outer Layer Width - 3 oz. Cu. Base
    0.012
    0.01
    Outer Layer Space - Trace to Trace - 1/4 & 3/8 oz. Cu. Base
    0.003
    Outer Layer Space - Trace to Trace - 1/2 oz. Cu. Base
    0.004
    Outer Layer Space - Trace to Trace - 1 oz. Cu. Base
    0.005
    Outer Layer Space - Trace to Trace - 2 oz. Cu. Base
    0.008
    Outer Layer Space - Trace to Trace - 3 oz. Cu. Base
    0.012
    0.01
    Gold Body / Bi-Level Gold w/ 0.25oz foil
    Gold Body / Bi-Level Gold w/ 0.5oz foil
    0.004
    Minimum Outer Layer Trace Widths for Boards With Filled and Plated Over Vias.
    0.005
    0.003
    Minimum Outer Layer Spacing for Boards With Filled and Plated Over Vias.
    0.005
    0.003
    Etch Requirements
    Minimum copper sliver between antipads
    0.005
    0.004
    Etch Tolerance and factor 1/2 OZ Cu or less inner/outer NO VF
    +/-.00075
    +/-.0005
    Etch Tolerance and factor 1/2 OZ Cu or less inner/outer w/ VF
    +/-.0015
    +/-.001
    Etch Tolerance and factor 1 OZ Cu inner/outer NO VF
    +/-.0015
    +/-.001
    Etch Tolerance and factor 2 OZ Cu inner/outer NO VF
    +/-.002
    +/-.0015
    Etch Tolerance and factor 3 OZ Cu inner/outer NO VF
    +/-.0025
    +/-.002
    Minimum copper sliver between antipads
    0.005
    0.005
    Etch Tolerance and factor 1/2 OZ Cu or less inner/outer NO VF
    20%
    15%
    10%
    Etch Tolerance and factor 1/2 OZ Cu or less inner/outer w/ VF
    20%
    15%
    10%
    Etch Tolerance and factor 1 OZ Cu inner/outer NO VF
    20%
    15%
    10%
    Etch Tolerance and factor 2 OZ Cu inner/outer NO VF
    20%
    15%
    10%
    Etch Tolerance and factor 3 OZ Cu inner/outer NO VF
    20%
    15%
    Minimum copper sliver between antipads
    0.005
    0.004
    Etch Tolerance and factor 1/2 OZ Cu or less inner/outer NO VF
    +/-.00075
    +/-.0005
    Etch Tolerance and factor 1/2 OZ Cu or less inner/outer w/ VF
    +/-.0015
    +/-.001
    Etch Tolerance and factor 1 OZ Cu inner/outer NO VF
    +/-.0015
    +/-.001
    Etch Tolerance and factor 2 OZ Cu inner/outer NO VF
    +/-.002
    +/-.0015
    Etch Tolerance and factor 3 OZ Cu inner/outer NO VF
    +/-.0025
    +/-.002
    Minimum copper sliver between antipads
    0.005
    0.004
    Etch Tolerance and factor 1/2 OZ Cu or less inner/outer NO VF
    +/-.00075
    +/-.0005
    Etch Tolerance and factor 1/2 OZ Cu or less inner/outer w/ VF
    +/-.0015
    +/-.001
    Etch Tolerance and factor 1 OZ Cu inner/outer NO VF
    +/-.0015
    +/-.001
    Etch Tolerance and factor 2 OZ Cu inner/outer NO VF
    +/-.002
    +/-.0015
    Etch Tolerance and factor 3 OZ Cu inner/outer NO VF
    +/-.0025
    +/-.002
    Minimum copper sliver between antipads
    0.005
    0.004
    Etch Tolerance and factor 1/2 OZ Cu or less inner/outer NO VF
    +/-.00075
    +/-.0005
    Etch Tolerance and factor 1/2 OZ Cu or less inner/outer w/ VF
    +/-.001
    +/-.001
    Etch Tolerance and factor 1 OZ Cu inner/outer NO VF
    +/-.002
    +/-.0015
    Etch Tolerance and factor 2 OZ Cu inner/outer NO VF
    +/-.0025
    +/-.002
    Etch Tolerance and factor 3 OZ Cu inner/outer NO VF
    +/-.003
    +/-.003
    Minimum copper sliver between antipads
    0.005
    0.004
    Etch Tolerance and factor 1/2 OZ Cu or less inner/outer NO VF
    +/-.002
    +/-.001
    Etch Tolerance and factor 1/2 OZ Cu or less inner/outer w/ VF
    +/-.002
    +/-.001
    Etch Tolerance and factor 1 OZ Cu inner/outer NO VF
    +/-.002
    +/-.001
    Etch Tolerance and factor 2 OZ Cu inner/outer NO VF
    +/-.002
    +/-.0016
    Etch Tolerance and factor 3 OZ Cu inner/outer NO VF
    +/-.003
    +/-.0024
    Drill & Rout
    Smallest PTH - Via HDI
    Smallest Mechanical PTH - Via (aspect ratio driven)
    0.0059
    0.005
    Smallest PTH - Component
    0.015
    PTH - Tolerance
    0.003
    0.002
    0.0015
    PTH - Tolerance Press Fit
    0.0025
    0.002
    0.0015
    NPTH - Tolerance
    0.002
    0.001
    NPTH - Slot Tolerance
    +/-.004
    +/- .003
    +/-.002
    PTH - Slot Tolerance
    +/-.005
    +/-.004
    +/-.003
    Standard Rout Tolerances
    +/-.005
    +/-.004
    +/-.003
    Optical Rout Tolerances (Rout edge to feature location)
    +/-.003
    +/-.002
    +/-.0015
    Aspect Ratio - Plated Through Holes - > .020" drilled
    10:1
    12:1
    14:1
    Aspect Ratio - Plated Through Holes - .010"-.019" drilled
    10:1
    12:1
    14:1
    Minimum Drill to Copper for PTH
    0.01
    0.008
    0.006
    Minimum Drill to Copper for PTH Sub Asemblies
    0.008
    0.006
    0.005
    Minimum Drill to Copper for Laser uVias
    0.006
    0.004
    Minimum hole to hole edge for PTH
    0.012
    0.01
    0.008
    Minimum hole to hole edge for Laser uVias
    0.008
    0.005
    Drill/Pad Size - No Break Out - Thru drill.
    nominal +.015
    nominal + .012
    Drill/Pad Size - No Break Out - HDI
    nominal +.006
    nominal + .005
    Minimum Pad
    0.015
    0.01
    0.008
    Minimum Isolated Pad
    0.01
    0.009
    0.008
    Minimum Laser Drilled pad
    0.01
    0.008
    0.004
    SMT Pitch
    0.01
    0.008
    0.006
    Buried Vias - Mechanical Drill Minimum Size
    0.0059
    0.005
    0.004
    Buried Vias - Mechanical Drill - Max Aspect Ratio
    10:1
    12:1
    14:1
    Blind Vias - Mechanical Drill Minimum
    0.0059
    0.005
    Blind Vias - Mechanical Drill - Max Aspect Ratio
    .7:1
    .8:1
    1:1
    Blind Vias - Laser Drilled. - Minimum Size
    0.004
    0.003
    0.002
    Blind Vias - Laser Drilled. - Maximum Size
    0.007
    0.008
    0.009
    Blind Vias - Laser Drilled. - Maximum Aspect Ratio.
    .7:1
    .8:1
    1:01
    Maximum Copper Fill Depth Micro uVias
    0.004
    0.005
    0.006
    Back Drill Depth Remaning Stub
    0.01
    0.008
    0.006
    Back Drill - Minimum Over Primary Drill Size (Oversize bit will depend on primary drill size)
    +.012-.007
    Back Drill - Depth Tolerance
    +/-.005
    +/-.003
    +/-.002
    Min Back Drill Depth for filled & plated over BD holes
    0.01
    0.006
    Drill True Position Tolerance Standard (+/-)
    0.005
    0.004
    0.003
    Drill True Position Tolerance w/ camera alignment (+/-)
    0.003
    0.002
    0.001
    Drill hole to hole positional tolerance (+/-)
    0.003
    0.002
    Minimum PTH Size That Can Be Filled With Non Conductive Material and Plated Over
    0.0079
    0.0059
    0.005
    Maximum PTH Size That Can Be Filled With Non Conductive Material and Plated Over
    0.018
    0.02
    Smallest PTH - Via HDI
    0.006
    0.004
    0.003
    Smallest Mechanical PTH - Via (aspect ratio driven)
    0.0059
    0.0051
    0.004
    Smallest PTH - Component
    0.018
    0.012
    PTH - Tolerance
    +/-.003
    +/-.002
    +/-.0015
    PTH - Tolerance Press Fit
    +/-.002
    +/-.002
    +/-.0015
    NPTH - Tolerance
    +/-.002
    +/-.001
    NPTH - Slot Tolerance
    +/-.003
    +/-.002
    +/-.0015
    PTH - Slot Tolerance
    +/-.004
    +/-.003
    +/-.002
    Standard Rout Tolerances
    +/-.005
    +/-.004
    +/-.003
    Optical Rout Tolerances (Rout edge to feature location)
    +/-.003
    +/-.002
    +/-.0015
    Aspect Ratio - Plated Through Holes - > .020" drilled
    10:1
    12.5:1
    Aspect Ratio - Plated Through Holes - .010"-.019" drilled
    10:1
    12.5:1
    14:1
    Minimum Drill to Copper for PTH
    0.008
    0.007
    0.006
    Minimum Drill to Copper for PTH Sub Asemblies
    0.008
    0.007
    0.006
    Minimum Drill to Copper for Laser uVias
    0.005
    0.004
    0.0035
    Minimum hole to hole edge for PTH
    0.015
    0.008
    0.007
    Minimum hole to hole edge for Laser uVias
    0.005
    0.004
    0.0035
    Drill/Pad Size - No Break Out - Thru drill.
    nominal +.012
    nominal + .010
    nominal + .008
    Drill/Pad Size - No Break Out - HDI
    nominal +.006
    nominal + .005
    nominal + .004
    Minimum Pad
    0.012
    0.01
    N/A
    Minimum Isolated Pad
    0.015
    0.01
    0.008
    Minimum Laser Drilled pad
    0.01
    0.008
    0.006
    SMT Pitch
    0.01
    0.008
    0.006
    Buried Vias - Mechanical Drill Minimum Size
    0.0059
    0.0051
    0.004
    Buried Vias - Mechanical Drill - Max Aspect Ratio
    12:1
    13:1
    15:1
    Blind Vias - Mechanical Drill Minimum
    0.0059
    0.0051
    0.004
    Blind Vias - Mechanical Drill - Max Aspect Ratio
    .7:1
    .8:1
    1:1
    Blind Vias - Laser Drilled. - Minimum Size
    0.004
    0.003
    0.002
    Blind Vias - Laser Drilled. - Maximum Size
    0.01
    0.012
    N/A
    Blind Vias - Laser Drilled. - Maximum Aspect Ratio.
    10:1
    12:1
    N/A
    Maximum Copper Fill Depth Micro uVias
    0.006
    0.008
    0.01
    Back Drill Depth Remaning Stub
    0.01
    0.008
    0.006
    Back Drill - Minimum Over Primary Drill Size (Oversize bit will depend on primary drill size)
    0.012
    0.01
    0.008
    Back Drill - Depth Tolerance
    +/-.005
    +/-.003
    +/-.002
    Min Back Drill Depth for filled & plated over BD holes
    0.01
    0.006
    Drill True Position Tolerance Standard (+/-)
    0.005
    0.003
    Drill True Position Tolerance w/ camera alignment (+/-)
    0.003
    0.002
    0.001
    Drill hole to hole positional tolerance (+/-)
    0.003
    0.0025
    0.002
    Minimum PTH Size That Can Be Filled With Non Conductive Material and Plated Over
    0.006
    0.005
    Maximum PTH Size That Can Be Filled With Non Conductive Material and Plated Over
    0.018
    0.025
    0.03
    Smallest PTH - Via HDI
    0.006
    0.005
    ≤.004
    Smallest Mechanical PTH - Via (aspect ratio driven)
    0.0059
    0.005
    Smallest PTH - Component
    0.015
    PTH - Tolerance
    0.003
    0.002
    0.0015
    PTH - Tolerance Press Fit
    0.0025
    0.002
    0.0015
    NPTH - Tolerance
    0.002
    0.001
    NPTH - Slot Tolerance
    +/-.004
    +/- .003
    +/-.002
    PTH - Slot Tolerance
    +/-.005
    +/-.004
    +/-.003
    Standard Rout Tolerances
    +/-.005
    +/-.004
    +/-.003
    Optical Rout Tolerances (Rout edge to feature location)
    0.004
    0.003
    Aspect Ratio - Plated Through Holes - > .020" drilled
    10:1
    13:1
    16:1
    Aspect Ratio - Plated Through Holes - .010"-.019" drilled
    10:1
    13:1
    16:1
    Minimum Drill to Copper for PTH
    0.01
    0.008
    0.007
    Minimum Drill to Copper for PTH Sub Asemblies
    0.008
    0.007
    Minimum Drill to Copper for Laser uVias
    0.006
    0.0025
    0.002
    Minimum hole to hole edge for PTH
    0.012
    0.01
    0.008
    Minimum hole to hole edge for Laser uVias
    0.008
    0.005
    ≤.005
    Drill/Pad Size - No Break Out - Thru drill.
    nominal +.014
    nominal + .012
    Drill/Pad Size - No Break Out - HDI
    nominal +.006
    nominal + .005
    Minimum Pad
    0.01
    0.008
    0.008
    Minimum Isolated Pad
    0.012
    0.01
    0.008
    Minimum Laser Drilled pad
    0.012
    0.01
    0.008
    SMT Pitch
    0.016
    Buried Vias - Mechanical Drill Minimum Size
    0.0079
    0.0059
    Buried Vias - Mechanical Drill - Max Aspect Ratio
    10:1
    12:1
    14:1
    Blind Vias - Mechanical Drill Minimum
    0.0079
    0.0059
    Blind Vias - Mechanical Drill - Max Aspect Ratio
    10:01
    12:01
    14:01
    Blind Vias - Laser Drilled. - Minimum Size
    0.006
    0.0055
    Blind Vias - Laser Drilled. - Maximum Size
    0.007
    0.008
    0.009
    Blind Vias - Laser Drilled. - Maximum Aspect Ratio.
    .5:1
    0.75:1
    .85:1
    Maximum Copper Fill Depth Micro uVias
    0.003
    0.004
    0.006
    Back Drill Depth Remaning Stub
    0.01
    0.008
    0.006
    Back Drill - Minimum Over Primary Drill Size (Oversize bit will depend on primary drill size)
    0.01
    0.009
    0.008
    Back Drill - Depth Tolerance
    +/-.005
    +/-.003
    +/-.002
    Min Back Drill Depth for filled & plated over BD holes
    0.01
    0.009
    Drill True Position Tolerance Standard (+/-)
    0.003
    0.002
    Drill True Position Tolerance w/ camera alignment (+/-)
    0.002
    0.0018
    Drill hole to hole positional tolerance (+/-)
    0.003
    0.002
    Minimum PTH Size That Can Be Filled With Non Conductive Material and Plated Over
    0.0098
    0.0079
    Maximum PTH Size That Can Be Filled With Non Conductive Material and Plated Over
    0.035
    0.04
    Smallest PTH - Via HDI
    Smallest Mechanical PTH - Via (aspect ratio driven)
    0.0059
    0.005
    Smallest PTH - Component
    0.015
    0.012
    PTH - Tolerance
    +/-.003
    +/-.002
    +/-.0015
    PTH - Tolerance Press Fit
    +/-.0025
    +/-.002
    +/-.0015
    NPTH - Tolerance
    +/-.002
    +/-.001
    NPTH - Slot Tolerance
    PTH - Slot Tolerance
    Standard Rout Tolerances
    +/-.005
    +/-.004
    +/-.003
    Optical Rout Tolerances (Rout edge to feature location)
    +/-.003
    +/-.002
    +/-.0015
    Aspect Ratio - Plated Through Holes - > .020" drilled
    10:1
    12:1
    14:1
    Aspect Ratio - Plated Through Holes - .010"-.019" drilled
    10:1
    12:1
    14:1
    Minimum Drill to Copper for PTH
    0.01
    0.008
    0.006
    Minimum Drill to Copper for PTH Sub Asemblies
    0.01
    0.008
    0.006
    Minimum Drill to Copper for Laser uVias
    0.006
    0.005
    Minimum hole to hole edge for PTH
    0.012
    0.01
    0.008
    Minimum hole to hole edge for Laser uVias
    0.008
    0.006
    Drill/Pad Size - No Break Out - Thru drill.
    nominal +.017
    nominal + .015
    Drill/Pad Size - No Break Out - HDI
    nominal +.006
    nomina + .005
    Minimum Pad
    0.015
    0.01
    0.008
    Minimum Isolated Pad
    0.015
    0.01
    0.008
    Minimum Laser Drilled pad
    0.012
    0.01
    0.008
    SMT Pitch
    0.01
    0.008
    0.006
    Buried Vias - Mechanical Drill Minimum Size
    0.008
    0.006
    0.004
    Buried Vias - Mechanical Drill - Max Aspect Ratio
    10:1
    12:1
    14:1
    Blind Vias - Mechanical Drill Minimum
    0.008
    0.006
    0.004
    Blind Vias - Mechanical Drill - Max Aspect Ratio
    10:1
    12:1
    14:1
    Blind Vias - Laser Drilled. - Minimum Size
    0.004
    0.003
    0.002
    Blind Vias - Laser Drilled. - Maximum Size
    0.007
    0.008
    0.009
    Blind Vias - Laser Drilled. - Maximum Aspect Ratio.
    0.5:1
    0.75:1
    1:1
    Maximum Copper Fill Depth Micro uVias
    0.004
    0.005
    0.006
    Back Drill Depth Remaning Stub
    0.01
    0.008
    0.006
    Back Drill - Minimum Over Primary Drill Size (Oversize bit will depend on primary drill size)
    0.012
    0.01
    0.008
    Back Drill - Depth Tolerance
    +/-.005
    +/-.003
    +/-.002
    Min Back Drill Depth for filled & plated over BD holes
    0.01
    0.008
    Drill True Position Tolerance Standard (+/-)
    0.006
    0.005
    0.004
    Drill True Position Tolerance w/ camera alignment (+/-)
    0.003
    0.002
    0.001
    Drill hole to hole positional tolerance (+/-)
    0.003
    0.0025
    0.002
    Minimum PTH Size That Can Be Filled With Non Conductive Material and Plated Over
    0.0091
    0.0078
    Maximum PTH Size That Can Be Filled With Non Conductive Material and Plated Over
    0.025
    0.028
    .0.038
    Smallest PTH - Via HDI
    Smallest Mechanical PTH - Via (aspect ratio driven)
    0.0043
    Smallest PTH - Component
    0.015
    PTH - Tolerance
    0.003
    0.002
    PTH - Tolerance Press Fit
    0.002
    0.002
    NPTH - Tolerance
    0.002
    0.002
    NPTH - Slot Tolerance
    +/-.004
    +/-.004
    PTH - Slot Tolerance
    +/-.005
    +/-.004
    Standard Rout Tolerances
    +/-.005
    +/-.004
    Optical Rout Tolerances (Rout edge to feature location)
    -
    -
    Aspect Ratio - Plated Through Holes - > .020" drilled
    10:1
    12:1
    Aspect Ratio - Plated Through Holes - .010"-.019" drilled
    10:1
    12:1
    Minimum Drill to Copper for PTH
    0.007
    0.006
    Minimum Drill to Copper for PTH Sub Asemblies
    0.007
    0.006
    Minimum Drill to Copper for Laser uVias
    0.004
    0.004
    Minimum hole to hole edge for PTH
    0.01
    0.008
    Minimum hole to hole edge for Laser uVias
    0.006
    0.004
    Drill/Pad Size - No Break Out - Thru drill.
    nominal +.012
    nominal + .010
    Drill/Pad Size - No Break Out - HDI
    nominal +.006
    nominal + .005
    Minimum Pad
    0.012
    0.01
    Minimum Isolated Pad
    0.012
    0.01
    Minimum Laser Drilled pad
    0.01
    0.008
    SMT Pitch
    0.01
    0.008
    Buried Vias - Mechanical Drill Minimum Size
    0.0059
    0.005
    Buried Vias - Mechanical Drill - Max Aspect Ratio
    10:1
    12:1
    Blind Vias - Mechanical Drill Minimum
    0.0059
    0.0059
    Blind Vias - Mechanical Drill - Max Aspect Ratio
    .7:1
    .8:1
    Blind Vias - Laser Drilled. - Minimum Size
    0.004
    0.003
    Blind Vias - Laser Drilled. - Maximum Size
    0.008
    0.007
    Blind Vias - Laser Drilled. - Maximum Aspect Ratio.
    .75:1
    1:01
    Maximum Copper Fill Depth Micro uVias
    0.006
    0.005
    Back Drill Depth Remaning Stub
    0.008
    0.005
    Back Drill - Minimum Over Primary Drill Size (Oversize bit will depend on primary drill size)
    0.01
    0.008
    Back Drill - Depth Tolerance
    0.005
    0.003
    Min Back Drill Depth for filled & plated over BD holes
    0.01
    0.006
    Drill True Position Tolerance Standard (+/-)
    0.004
    0.003
    Drill True Position Tolerance w/ camera alignment (+/-)
    -
    -
    Drill hole to hole positional tolerance (+/-)
    0.003
    0.002
    Minimum PTH Size That Can Be Filled With Non Conductive Material and Plated Over
    0.0059
    0.0059
    Maximum PTH Size That Can Be Filled With Non Conductive Material and Plated Over
    0.04
    0.03
    Smallest PTH - Via HDI
    Smallest Mechanical PTH - Via (aspect ratio driven)
    0.006
    0.004
    Smallest PTH - Component
    0.015
    PTH - Tolerance
    0.003
    0.002
    PTH - Tolerance Press Fit
    0.003
    0.002
    NPTH - Tolerance
    0.002
    0.002
    NPTH - Slot Tolerance
    +/-0.005
    +/-0.003
    PTH - Slot Tolerance
    +/-0.005
    +/-0.003
    Standard Rout Tolerances
    +/-0.005
    +/-0.003
    Optical Rout Tolerances (Rout edge to feature location)
    Aspect Ratio - Plated Through Holes - > .020" drilled
    10:1
    Aspect Ratio - Plated Through Holes - .010"-.019" drilled
    10:1
    Minimum Drill to Copper for PTH
    0.01
    0.008
    Minimum Drill to Copper for PTH Sub Asemblies
    Minimum Drill to Copper for Laser uVias
    Minimum hole to hole edge for PTH
    0.01
    Minimum hole to hole edge for Laser uVias
    Drill/Pad Size - No Break Out - Thru drill.
    nominal + .01
    Drill/Pad Size - No Break Out - HDI
    Minimum Pad
    0.015
    Minimum Isolated Pad
    Minimum Laser Drilled pad
    SMT Pitch
    0.01
    Buried Vias - Mechanical Drill Minimum Size
    Buried Vias - Mechanical Drill - Max Aspect Ratio
    Blind Vias - Mechanical Drill Minimum
    Blind Vias - Mechanical Drill - Max Aspect Ratio
    Blind Vias - Laser Drilled. - Minimum Size
    Blind Vias - Laser Drilled. - Maximum Size
    Blind Vias - Laser Drilled. - Maximum Aspect Ratio.
    Maximum Copper Fill Depth Micro uVias
    Back Drill Depth Remaning Stub
    Back Drill - Minimum Over Primary Drill Size (Oversize bit will depend on primary drill size)
    Back Drill - Depth Tolerance
    Min Back Drill Depth for filled & plated over BD holes
    Drill True Position Tolerance Standard (+/-)
    0.005
    0.004
    Drill True Position Tolerance w/ camera alignment (+/-)
    Drill hole to hole positional tolerance (+/-)
    0.003
    0.002
    Minimum PTH Size That Can Be Filled With Non Conductive Material and Plated Over
    0.008
    .004 or 10:1 aspect ratio
    Maximum PTH Size That Can Be Filled With Non Conductive Material and Plated Over
    0.018
    2:1 aspect ratio
    Impedance
    Impedance - Tolerance
    +/-10%
    +/-5%
    <+/-5%
    Maximum Impedance - Value Ohms
    110Ω
    150Ω
    Minimum Impedance - Value Ohms
    28Ω
    25Ω
    Impedance Coupon Size
    .5"x 6"
    custom
    Impedance - Tolerance
    +/-10%
    +/-7%
    +/-5%
    Maximum Impedance - Value Ohms
    100Ω
    130Ω
    Minimum Impedance - Value Ohms
    28Ω
    25Ω
    Impedance Coupon Size
    7" X .500"
    .5"x 6"
    custom
    Impedance - Tolerance
    +/-10%
    +/-8%
    +/-5%
    Maximum Impedance - Value Ohms
    100Ω
    110Ω
    Minimum Impedance - Value Ohms
    50Ω
    40Ω
    Impedance Coupon Size
    .5"x 6"
    custom
    Impedance - Tolerance
    +/-10%
    +/-7%
    +/-5%
    Maximum Impedance - Value Ohms
    100Ω
    130Ω
    Minimum Impedance - Value Ohms
    28Ω
    25Ω
    Impedance Coupon Size
    .5"x 6"
    custom
    Impedance - Tolerance
    +/-10%
    +/-7%
    +/-5%
    Maximum Impedance - Value Ohms
    110Ω
    150Ω
    Minimum Impedance - Value Ohms
    35Ω
    25Ω
    Impedance Coupon Size
    .5"x 6"
    custom
    Impedance - Tolerance
    +/-10%
    +/-5%
    Maximum Impedance - Value Ohms
    120Ω
    Minimum Impedance - Value Ohms
    35Ω
    Impedance Coupon Size
    8"x1" (varies)
    Solder Mask & Silkscreen
    Solder Mask Web width over laminate (i.e. between pads)
    0.004
    0.003
    0.002
    Solder Mask Web width over copper (i.e. over a trace)
    0.003
    0.002
    0.002
    Solder Mask Clearance to Pad(i.e. annular ring)
    0.003
    0.002
    0.001
    Minimum Silkscreen line width / height (white only)
    4 mils / 15-20 mils
    3 mils /15-20 mils
    Standard Silkscreen line width / height
    5 mils / 25-30 mils
    N/A
    Maximum Tented Via
    0.016
    0.02
    Solder Mask Web width over laminate (i.e. between pads)
    0.0035
    0.003
    n/a
    Solder Mask Web width over copper (i.e. over a trace)
    0.0035
    0.003
    Solder Mask Clearance to Pad(i.e. annular ring)
    0.003
    0.002
    0.001
    Minimum Silkscreen line width / height (white only)
    0.004
    0.003
    Standard Silkscreen line width / height
    .004 / .020
    .003 / .025
    Maximum Tented Via
    0.014
    0.016
    0.018
    Solder Mask Web width over laminate (i.e. between pads)
    0.004
    0.0035
    0.003
    Solder Mask Web width over copper (i.e. over a trace)
    0.004
    0.0035
    0.003
    Solder Mask Clearance to Pad(i.e. annular ring)
    0.003
    0.002
    0.0015
    Minimum Silkscreen line width / height (white only)
    4 mils / 15-20 mils
    3 mils /15-20 mils
    N/A
    Standard Silkscreen line width / height
    5 mils / 25-30 mils
    Maximum Tented Via
    0.016
    0.02
    Solder Mask Web width over laminate (i.e. between pads)
    0.004
    0.003
    0.002
    Solder Mask Web width over copper (i.e. over a trace)
    0.003
    0.002
    0.002
    Solder Mask Clearance to Pad(i.e. annular ring)
    0.003
    0.002
    0.001
    Minimum Silkscreen line width / height (white only)
    4 mils / 15-20 mils
    3 mils /15-20 mils
    Standard Silkscreen line width / height
    5 mils / 25-30 mils
    N/A
    Maximum Tented Via
    0.016
    0.02
    Solder Mask Web width over laminate (i.e. between pads)
    0.004
    0.004
    Solder Mask Web width over copper (i.e. over a trace)
    0.004
    0.004
    Solder Mask Clearance to Pad(i.e. annular ring)
    0.004
    0.003
    Minimum Silkscreen line width / height (white only)
    3.5 mils / 15-20 mils
    3 mils /15-20 mils
    Standard Silkscreen line width / height
    6 mils / 25-30 mils
    Maximum Tented Via
    0.016
    0.02
    Solder Mask Web width over laminate (i.e. between pads)
    0.004
    0.003
    Solder Mask Web width over copper (i.e. over a trace)
    0.004
    0.003
    Solder Mask Clearance to Pad(i.e. annular ring)
    0.002
    Minimum Silkscreen line width / height (white only)
    0.005
    0.003
    Standard Silkscreen line width / height
    0.005
    Maximum Tented Via
    0.018
    Spacing & Registration
    Minimum Copper spacing To Board Edge
    0.01
    0.008
    0.005
    Minimum hole spacing To Board Edge
    0.01
    0.008
    0.005
    Layer to Layer Registration - Different Cores
    0.003
    0.002
    Outer layer feature True Position Tolerance
    0.006
    0.005
    0.003
    Front to Back Registration (Same Core)
    .001"
    .0005"
    HASL Pad to Pad Space & Pad Size (Ganged areas not doable for SC)
    .008'/.020"
    Minimum Copper spacing To Board Edge
    0.01
    0.008
    0.005
    Minimum hole spacing To Board Edge
    0.01
    0.008
    0.005
    Layer to Layer Registration - Different Cores
    0.003
    0.002
    Outer layer feature True Position Tolerance
    +/-.005
    +/-.003
    +/.002
    Front to Back Registration (Same Core)
    0.001"
    0.001"
    0.0005"
    HASL Pad to Pad Space & Pad Size (Ganged areas not doable for SC)
    0.006
    0.005
    0.004
    Minimum Copper spacing To Board Edge
    0.01
    0.008
    0.005
    Minimum hole spacing To Board Edge
    0.01
    0.008
    0.005
    Layer to Layer Registration - Different Cores
    .003
    0.002
    Outer layer feature True Position Tolerance
    20%
    15%
    Front to Back Registration (Same Core)
    0.002
    0.0015
    HASL Pad to Pad Space & Pad Size (Ganged areas not doable for SC)
    0.006
    0.005
    Minimum Copper spacing To Board Edge
    .010
    .008
    .005
    Minimum hole spacing To Board Edge
    .010
    .008
    .005
    Layer to Layer Registration - Different Cores
    0.005
    0.004
    0.003
    Outer layer feature True Position Tolerance
    0.006
    0.005
    0.004
    Front to Back Registration (Same Core)
    .001"
    0.0005"
    HASL Pad to Pad Space & Pad Size (Ganged areas not doable for SC)
    Minimum Copper spacing To Board Edge
    0.01
    0.008
    0.005
    Minimum hole spacing To Board Edge
    0.01
    0.008
    0.005
    Layer to Layer Registration - Different Cores
    0.003
    0.002
    Outer layer feature True Position Tolerance
    .001"
    .0005"
    Front to Back Registration (Same Core)
    0.006
    0.005
    0.003
    HASL Pad to Pad Space & Pad Size (Ganged areas not doable for SC)
    Minimum Copper spacing To Board Edge
    0.01
    Minimum hole spacing To Board Edge
    0.01
    Layer to Layer Registration - Different Cores
    -
    0.003
    Outer layer feature True Position Tolerance
    0.001
    Front to Back Registration (Same Core)
    0.006
    0.005
    HASL Pad to Pad Space & Pad Size (Ganged areas not doable for SC)

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    Our customer service and reliability is known as the very best in the industry, with  quick turn capabilities (same day and weekend turns available) and a readiness to manufacture and assemble any size run of PCBs. Check out our free PCB Artist Software and DFM File Check tools or request a quote to get started today.

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