Manufacturing Capabilities
We are a comprehensive solutions provider for all your PCB needs. From design through final assembly, small batch to high volume, quick-turnaround to long-lead times, AdvancedPCB is your go-to printed circuit board partner. Our capabilities range from standard technology to the most advanced products in the world. The products we manufacturing include HDI, UDHI, RF/microwave PCBs, flex and rigid-flex circuits, SMT and through-hole assembly and design layout services. If you have any questions about our capabilities, please give us a call at 1-800-979-4722, reach out to one of our product specialists here or find your regional sales contact here.
Select a facility to view capabilities
Attributes
Standard
Advanced
Development (NPI)
Maximum Board Size
16 x 22
16 x 52, 22 x 28
Maximum Panel Size
18 x 24
18 x 54, 24 x 30
36 x 119 DS
Maximum Board Thickness
0.25
Minimum Board Thickness
.010 Rigid
.008 Rigid
.006 Rigid
Overall Board Thickness Tolerance (+/- %)
10%
7%
5%
Warpage/ Bow and Twist capability - mils per Inch
0.0100
0.0075
0.0050
Maximum Rigid Layer Count
26
40
40 +
Maximum Flex Layer Count
N/A
N/A
N/A
Maximum Rigid-Flex Layer Count
N/A
N/A
N/A
Minimum Core Thickness
0.004
0.002
0.0010
Minimum Dielectric Thickness
0.002
0.001
N/A
Lam Cycles Rigid
3x
6x
>6x
Lam Cycles Flex
N/A
N/A
N/A
Lam Cycles Rigid-Flex
N/A
N/A
N/A
Trace/Space - Base Copper Thickness
Inner Layer Width - 1/4 oz. Cu
Inner Layer with - 1/2 oz Cu
0.003
0.0025
-
Inner Layer Width - 1 oz. Cu
0.004
0.0035
Inner Layer Width - 2 oz. Cu
0.006
0.0055
-
Inner Layer Width - 3 oz. Cu
0.008
0.007
Inner Layer Width - 4 oz. Cu
0.01
0.009
Inner Layer Space - Trace to Trace - 1/2 oz. Cu
0.003
0.0025
Inner Layer Space - Trace to Trace - 1 oz. Cu
0.004
0.004
Inner Layer Space - Trace to Trace - 2 oz. Cu
0.007
0.006
Inner Layer Space - Trace to Trace - 3 oz. Cu
0.01
0.009
Inner Layer Space - Trace to Trace - 4 oz. Cu
0.013
0.012
Outer Layer Width - 1/4 & 3/8 oz. Cu. Base
0.003
0.0025
Outer Layer Width - 1/2 oz. Cu. Base
0.003
0.0025
Outer Layer Width - 1 oz. Cu. Base
0.004
0.004
Outer Layer Width - 2 oz. Cu. Base
0.005
0.005
Outer Layer Width - 3 oz. Cu. Base
0.008
0.008
Outer Layer Space - Trace to Trace - 1/4 & 3/8 oz. Cu. Base
0.003
0.0025
Outer Layer Space - Trace to Trace - 1/2 oz. Cu. Base
0.003
0.0025
Outer Layer Space - Trace to Trace - 1 oz. Cu. Base
0.005
0.004
Outer Layer Space - Trace to Trace - 2 oz. Cu. Base
0.007
0.006
Outer Layer Space - Trace to Trace - 3 oz. Cu. Base
0.008
0.007
Gold Body / Bi-Level Gold w/ 0.25oz foil
0.0035
0.003
Gold Body / Bi-Level Gold w/ 0.5oz foil
0.004
0.0035
Minimum Outer Layer Trace Widths for Boards With Filled and Plated Over Vias.
0.004
0.0035
Minimum Outer Layer Spacing for Boards With Filled and Plated Over Vias.
0.004
0.0035
Etch Requirements
Minimum copper sliver between antipads
0.005
0.004
Etch Tolerance and factor 1/2 OZ Cu or less inner/outer NO VF
+/-.00075
+/-.0005
Etch Tolerance and factor 1/2 OZ Cu or less inner/outer w/ VF
+/-.001
+/-.001
Etch Tolerance and factor 1 OZ Cu inner/outer NO VF
+/-.002
+/-.0015
Etch Tolerance and factor 2 OZ Cu inner/outer NO VF
+/-.0025
+/-.002
Etch Tolerance and factor 3 OZ Cu inner/outer NO VF
+/-.003
+/-.003
Drill & Rout
Smallest PTH - Via HDI
Smallest Mechanical PTH - Via (aspect ratio driven)
0.0043
Smallest PTH - Component
0.015
PTH - Tolerance
0.003
0.002
PTH - Tolerance Press Fit
0.002
0.002
NPTH - Tolerance
0.002
0.002
NPTH - Slot Tolerance
+/-.004
+/-.004
PTH - Slot Tolerance
+/-.005
+/-.004
Standard Rout Tolerances
+/-.005
+/-.004
Optical Rout Tolerances (Rout edge to feature location)
-
-
Aspect Ratio - Plated Through Holes - > .020" drilled
10:1
12:1
Aspect Ratio - Plated Through Holes - .010"-.019" drilled
10:1
12:1
Minimum Drill to Copper for PTH
0.007
0.006
Minimum Drill to Copper for PTH Sub Asemblies
0.007
0.006
Minimum Drill to Copper for Laser uVias
0.004
0.004
Minimum hole to hole edge for PTH
0.01
0.008
Minimum hole to hole edge for Laser uVias
0.006
0.004
Drill/Pad Size - No Break Out - Thru drill.
nominal +.012
nominal + .010
Drill/Pad Size - No Break Out - HDI
nominal +.006
nominal + .005
Minimum Pad
0.012
0.01
Minimum Isolated Pad
0.012
0.01
Minimum Laser Drilled pad
0.01
0.008
SMT Pitch
0.01
0.008
Buried Vias - Mechanical Drill Minimum Size
0.0059
0.005
Buried Vias - Mechanical Drill - Max Aspect Ratio
10:1
12:1
Blind Vias - Mechanical Drill Minimum
0.0059
0.0059
Blind Vias - Mechanical Drill - Max Aspect Ratio
.7:1
.8:1
Blind Vias - Laser Drilled. - Minimum Size
0.004
0.003
Blind Vias - Laser Drilled. - Maximum Size
0.008
0.007
Blind Vias - Laser Drilled. - Maximum Aspect Ratio.
.75:1
1:01
Maximum Copper Fill Depth Micro uVias
0.006
0.005
Back Drill Depth Remaning Stub
0.008
0.005
Back Drill - Minimum Over Primary Drill Size (Oversize bit will depend on primary drill size)
0.01
0.008
Back Drill - Depth Tolerance
0.005
0.003
Min Back Drill Depth for filled & plated over BD holes
0.01
0.006
Drill True Position Tolerance Standard (+/-)
0.004
0.003
Drill True Position Tolerance w/ camera alignment (+/-)
-
-
Drill hole to hole positional tolerance (+/-)
0.003
0.002
Minimum PTH Size That Can Be Filled With Non Conductive Material and Plated Over
0.0059
0.0059
Maximum PTH Size That Can Be Filled With Non Conductive Material and Plated Over
0.04
0.03
Impedance
Impedance - Tolerance
+/-10%
+/-7%
+/-5%
Maximum Impedance - Value Ohms
110Ω
150Ω
Minimum Impedance - Value Ohms
35Ω
25Ω
Impedance Coupon Size
.5"x 6"
custom
Solder Mask & Silkscreen
Solder Mask Web width over laminate (i.e. between pads)
0.004
0.004
Solder Mask Web width over copper (i.e. over a trace)
0.004
0.004
Solder Mask Clearance to Pad(i.e. annular ring)
0.004
0.003
Minimum Silkscreen line width / height (white only)
3.5 mils / 15-20 mils
3 mils /15-20 mils
Standard Silkscreen line width / height
6 mils / 25-30 mils
Maximum Tented Via
0.016
0.02
Spacing & Registration
Minimum Copper spacing To Board Edge
0.01
0.008
0.005
Minimum hole spacing To Board Edge
0.01
0.008
0.005
Layer to Layer Registration - Different Cores
0.003
0.002
Outer layer feature True Position Tolerance
.001"
.0005"
Front to Back Registration (Same Core)
0.006
0.005
0.003
HASL Pad to Pad Space & Pad Size (Ganged areas not doable for SC)
Premier PCBs Manufactured in the USA
AdvancedPCB is one of the few PCB suppliers that is able to manufacture PCBs to support government programs. Since we are not a broker, all of our printed circuit boards are manufactured in USA facilities with a broad range of advanced capabilities for high reliability, precision, and powerful PCB performance for critical applications.
Let’s Innovate Together
Our customer service and reliability is known as the very best in the industry, with quick turn capabilities (same day and weekend turns available) and a readiness to manufacture and assemble any size run of PCBs. Check out our free PCB Artist Software and DFM File Check tools or request a quote to get started today.