Manufacturing Capabilities
We are a comprehensive solutions provider for all your PCB needs. From design through final assembly, small batch to high volume, quick-turnaround to long-lead times, AdvancedPCB is your go-to printed circuit board partner. Our capabilities range from standard technology to the most advanced products in the world. The products we manufacturing include HDI, UDHI, RF/microwave PCBs, flex and rigid-flex circuits, SMT and through-hole assembly and design layout services. If you have any questions about our capabilities, please give us a call at 1-800-979-4722, reach out to one of our product specialists here or find your regional sales contact here.
Select a facility to view capabilities
Attributes
Standard
Advanced
Development (NPI)
Maximum Board Size
16x22
18x22
N/A
Maximum Panel Size
18x24
21x24
N/A
Maximum Board Thickness
0.125
0.25
N/A
Minimum Board Thickness
0.01
0.008
0.005
Overall Board Thickness Tolerance (+/- %)
10%
7%
5%
Warpage/ Bow and Twist capability - mils per Inch
0.0075
0.0060
0.0050
Maximum Rigid Layer Count
< 20
38
>40
Maximum Flex Layer Count
Maximum Rigid-Flex Layer Count
Minimum Core Thickness
0.002
Minimum Dielectric Thickness
0.003
0.002
0.0015
Lam Cycles Rigid
4X
6X
>6
Lam Cycles Flex
N/A
N/A
N/A
Lam Cycles Rigid-Flex
N/A
N/A
N/A
Trace/Space - Base Copper Thickness
Inner Layer Width - 1/4 oz. Cu
0.0025
0.002
0.0015
Inner Layer with - 1/2 oz Cu
0.003
0.0025
0.002
Inner Layer Width - 1 oz. Cu
0.004
0.0035
0.003
Inner Layer Width - 2 oz. Cu
0.006
0.0055
0.005
Inner Layer Width - 3 oz. Cu
0.008
0.0075
0.007
Inner Layer Width - 4 oz. Cu
0.01
0.009
Inner Layer Space - Trace to Trace - 1/2 oz. Cu
0.003
0.003
0.00275
Inner Layer Space - Trace to Trace - 1 oz. Cu
0.005
0.004
0.0035
Inner Layer Space - Trace to Trace - 2 oz. Cu
0.006
0.005
0.00475
Inner Layer Space - Trace to Trace - 3 oz. Cu
0.008
0.0075
0.007
Inner Layer Space - Trace to Trace - 4 oz. Cu
0.01
0.009
Outer Layer Width - 1/4 & 3/8 oz. Cu. Base
0.003
0.0025
0.002
Outer Layer Width - 1/2 oz. Cu. Base
0.0035
0.003
0.0025
Outer Layer Width - 1 oz. Cu. Base
0.005
0.004
0.003
Outer Layer Width - 2 oz. Cu. Base
0.007
0.006
0.0055
Outer Layer Width - 3 oz. Cu. Base
0.009
0.008
n/a
Outer Layer Space - Trace to Trace - 1/4 & 3/8 oz. Cu. Base
0.003
0.00275
0.0025
Outer Layer Space - Trace to Trace - 1/2 oz. Cu. Base
0.00375
0.0035
0.00325
Outer Layer Space - Trace to Trace - 1 oz. Cu. Base
0.006
0.0055
0.005
Outer Layer Space - Trace to Trace - 2 oz. Cu. Base
0.007
0.006
Outer Layer Space - Trace to Trace - 3 oz. Cu. Base
0.009
0.008
Gold Body / Bi-Level Gold w/ 0.25oz foil
0.004
0.0035
Gold Body / Bi-Level Gold w/ 0.5oz foil
0.0045
0.004
Minimum Outer Layer Trace Widths for Boards With Filled and Plated Over Vias.
0.005
0.004
0.003
Minimum Outer Layer Spacing for Boards With Filled and Plated Over Vias.
0.006
0.005
0.004
Etch Requirements
Minimum copper sliver between antipads
0.005
0.005
Etch Tolerance and factor 1/2 OZ Cu or less inner/outer NO VF
20%
15%
10%
Etch Tolerance and factor 1/2 OZ Cu or less inner/outer w/ VF
20%
15%
10%
Etch Tolerance and factor 1 OZ Cu inner/outer NO VF
20%
15%
10%
Etch Tolerance and factor 2 OZ Cu inner/outer NO VF
20%
15%
10%
Etch Tolerance and factor 3 OZ Cu inner/outer NO VF
20%
15%
Drill & Rout
Smallest PTH - Via HDI
0.006
0.004
0.003
Smallest Mechanical PTH - Via (aspect ratio driven)
0.0059
0.0051
0.004
Smallest PTH - Component
0.018
0.012
PTH - Tolerance
+/-.003
+/-.002
+/-.0015
PTH - Tolerance Press Fit
+/-.002
+/-.002
+/-.0015
NPTH - Tolerance
+/-.002
+/-.001
NPTH - Slot Tolerance
+/-.003
+/-.002
+/-.0015
PTH - Slot Tolerance
+/-.004
+/-.003
+/-.002
Standard Rout Tolerances
+/-.005
+/-.004
+/-.003
Optical Rout Tolerances (Rout edge to feature location)
+/-.003
+/-.002
+/-.0015
Aspect Ratio - Plated Through Holes - > .020" drilled
10:1
12.5:1
Aspect Ratio - Plated Through Holes - .010"-.019" drilled
10:1
12.5:1
14:1
Minimum Drill to Copper for PTH
0.008
0.007
0.006
Minimum Drill to Copper for PTH Sub Asemblies
0.008
0.007
0.006
Minimum Drill to Copper for Laser uVias
0.005
0.004
0.0035
Minimum hole to hole edge for PTH
0.015
0.008
0.007
Minimum hole to hole edge for Laser uVias
0.005
0.004
0.0035
Drill/Pad Size - No Break Out - Thru drill.
nominal +.012
nominal + .010
nominal + .008
Drill/Pad Size - No Break Out - HDI
nominal +.006
nominal + .005
nominal + .004
Minimum Pad
0.012
0.01
N/A
Minimum Isolated Pad
0.015
0.01
0.008
Minimum Laser Drilled pad
0.01
0.008
0.006
SMT Pitch
0.01
0.008
0.006
Buried Vias - Mechanical Drill Minimum Size
0.0059
0.0051
0.004
Buried Vias - Mechanical Drill - Max Aspect Ratio
12:1
13:1
15:1
Blind Vias - Mechanical Drill Minimum
0.0059
0.0051
0.004
Blind Vias - Mechanical Drill - Max Aspect Ratio
.7:1
.8:1
1:1
Blind Vias - Laser Drilled. - Minimum Size
0.004
0.003
0.002
Blind Vias - Laser Drilled. - Maximum Size
0.01
0.012
N/A
Blind Vias - Laser Drilled. - Maximum Aspect Ratio.
10:1
12:1
N/A
Maximum Copper Fill Depth Micro uVias
0.006
0.008
0.01
Back Drill Depth Remaning Stub
0.01
0.008
0.006
Back Drill - Minimum Over Primary Drill Size (Oversize bit will depend on primary drill size)
0.012
0.01
0.008
Back Drill - Depth Tolerance
+/-.005
+/-.003
+/-.002
Min Back Drill Depth for filled & plated over BD holes
0.01
0.006
Drill True Position Tolerance Standard (+/-)
0.005
0.003
Drill True Position Tolerance w/ camera alignment (+/-)
0.003
0.002
0.001
Drill hole to hole positional tolerance (+/-)
0.003
0.0025
0.002
Minimum PTH Size That Can Be Filled With Non Conductive Material and Plated Over
0.006
0.005
Maximum PTH Size That Can Be Filled With Non Conductive Material and Plated Over
0.018
0.025
0.03
Impedance
Impedance - Tolerance
+/-10%
+/-7%
+/-5%
Maximum Impedance - Value Ohms
100Ω
130Ω
Minimum Impedance - Value Ohms
28Ω
25Ω
Impedance Coupon Size
7" X .500"
.5"x 6"
custom
Solder Mask & Silkscreen
Solder Mask Web width over laminate (i.e. between pads)
0.0035
0.003
n/a
Solder Mask Web width over copper (i.e. over a trace)
0.0035
0.003
Solder Mask Clearance to Pad(i.e. annular ring)
0.003
0.002
0.001
Minimum Silkscreen line width / height (white only)
0.004
0.003
Standard Silkscreen line width / height
.004 / .020
.003 / .025
Maximum Tented Via
0.014
0.016
0.018
Spacing & Registration
Minimum Copper spacing To Board Edge
0.01
0.008
0.005
Minimum hole spacing To Board Edge
0.01
0.008
0.005
Layer to Layer Registration - Different Cores
0.003
0.002
Outer layer feature True Position Tolerance
+/-.005
+/-.003
+/.002
Front to Back Registration (Same Core)
0.001"
0.001"
0.0005"
HASL Pad to Pad Space & Pad Size (Ganged areas not doable for SC)
0.006
0.005
0.004
Premier PCBs Manufactured in the USA
AdvancedPCB is one of the few PCB suppliers that is able to manufacture PCBs to support government programs. Since we are not a broker, all of our printed circuit boards are manufactured in USA facilities with a broad range of advanced capabilities for high reliability, precision, and powerful PCB performance for critical applications.
Let’s Innovate Together
Our customer service and reliability is known as the very best in the industry, with quick turn capabilities (same day and weekend turns available) and a readiness to manufacture and assemble any size run of PCBs. Check out our free PCB Artist Software and DFM File Check tools or request a quote to get started today.