Advanced PCBs

    Advanced PCBs come in a number of materials options, with a 0 to 40 layer count and multiple plating finishes. Quantity doesn’t matter; we will make as few as one PCB or as many as 10,000 without ever compromising the quality. All orders for advanced PCBs undergo the same rigorous fabrication and quality-check process — they are inspected to either IPC Class 2 or IPC Class 3 depending on the option chosen.

    Specifications
    Standard Specs
    Custom
    Layer Count
    0 - 10 Layers
    0 - 40 Layers
    Turn Time
    Same Day - 5 Day
    Same Day - 4 Weeks
    Quantity Req.
    1 - 10000+
    1 - 10000+
    Materials
    FR-4 
    FR-4 / Rogers / Polyimide / Aluminum Clad / High-Temp. FR4 / Others
    Plate Finish
    Lead-Free HAL*
    Electrolytic Hard Gold / Soft Gold / ENIG / ENIPIG/ Nickel / Immersion Silver / Leaded & Lead-Free HAL
    Cert. / Qualifications
    IPC Class 2 - A600
    IPC6012 Class 2-3A / IPC6012 Class 3 DS/IPC6018 Class 3 MIL-PRF-31032 / MIL-PRF-55110 / ISO 9001:2008 / AS9100D / Others 
    Board Thickness
    .031" / .062" / .093" / .125"
    Full Range Available
    Copper Weight
    1 oz. Inner / Up to 2 oz. Outer
    0.5 - 4 oz. Inner / 1-20 oz. Outer
    Trace / Space
    5 / 5 Mils
    Down to 2.75 / 3 Mils

    Standard vs. advanced

    Whether you need a double-sided or a multilayer PCB, AdvancedPCB is your one-stop printed circuit board provider. When deciding whether you need a standard PCB or an advanced PCB, start by looking at the specs.


    Specifications
    Standard
    Custom
    Layer Count
    0 - 10 Layers
    0 - 40 Layers
    Turn Time
    Same Day - 5 Day
    Same Day - 4 Weeks
    Quantity Req.
    1 - 10000+
    1 - 10000+
    Materials
    FR-4
    FR-4/Rogers/Polyimide/Aluminum Clad/High-Temp. FR4/Others »
    Plating Finish
    Lead-Free HAL*
    Electrolytic Hard Gold/Soft Gold/ENIG/Nickel/Immersion Silver OSP/Leaded & Lead-Free HAL
    Cert. / Qualifications
    IPC Class 2 - A600
    IPC6012 Class 2-3A / IPC6018 Class 3  MIL-PRF-31032 / MIL-PRF-55110 / ISO 9001:2008 / AS9100C / More »
    Board Thickness
    .031" / .062" / .093" / .125"
    Full Range Available
    Copper  Weight
    1 oz. Inner / Up to 2 oz. Outer
    0.5 - 4 oz. Inner / 1 - 20 oz. Outer
    Trace/Space
    5 / 5 Mils
    Down to 2.75 / 3 Mils
    Solder Mask (LPI)
    Green
    Various Color Options
    Legend
    White
    Various Color Options
    Min. Hole Size
    0.010"
    0.004"
    Hole Tolerance
    +/- 0.005"
    +/- 0.003" (Upon Request)
    Rout Tolerance
    +/- 0.010"
    +/- 0.005" (Upon Request)
    Slots/Cutouts/Edges
    Non-Plated Only
    Plated / Non-Plated
    Plated Holes
    Plated / Non-Plated
    Plated / Non-Plated
    UL Markings/Dates
    Yes**
    Yes**
    Lead-Free Markings
    Yes
    Yes
    Gold Fingers
    Yes
    Yes
    Fiducials
    Yes
    Yes
    Scoring
    Yes
    Yes
    ITAR
    Yes
    Yes
    Castellated Holes
    X
    Yes
    Controlled Dielectric
    X
    Yes
    Controlled Impedance
    X
    Yes
    Counter Sinks
    X
    Yes
    Counter Bores
    X
    Yes
    Blind/Buried Vias
    X
    Yes
    Microvias
    X
    Yes
    Mask Plugged Vias
    X
    Yes
    Via-in-Pad
    X
    Yes
    Etch Back
    X
    Yes
    Tetra Etch
    X
    Yes
    Cover Coat
    X
    Yes
    Cavity Process
    X
    Yes
    Laser Rout
    X
    Yes
    LPI Legend
    X
    Yes
    Edge Mill
    X
    Yes
    Unique Serialization
    X
    Yes
    Back Drilling
    X
    Yes
    Controlled Depth Drill
    X
    Yes

    * Standard Spec pricing assumes lead-free HAL. Alternatively, board finish may be upgraded to ENIG or Silver at no additional cost in the rare event lead-free HAL becomes temporarily unavailable. 

    ** Added markings contingent on available space on boards.  94V-0 may be added upon request at the time of order entry or if noted in files.  


    Please Note: Holes will be plated if no specifications provided.  Default Solder Mask color is Green unless another color option is requested.  Default Legend (Silkscreen) color is White unless another color option is requested.

    Still wondering whether or not your board is a Standard or Advanced PCB?

    If you are still debating standard vs. advanced PCB, keep in mind what you ultimately need your board to do. When you design your PCBs you can use our free DFM file check system to avoid CAM holds. You can also find a full list of capabilities online to help inform your decision.

    AdvancedPCBs: Capabilities

    AdvancedPCB manufacturing capabilities meet your unique product demands and design criteria:

    • Buried Chip Resistors
    • Blind and Buried Vias
    • Up to 40 layers
    • .00275" Trace/Space
    • Air Pockets between layers
    • Via-in-Pad
    • Cavity Boards
    • ITAR Registered
    • Stacked Microvias
    • Laser Drilled Microvias (HDI)
    • Laser Direct Imaging (LDI)
    • Down to .3mm Pitch
    • Heavy Copper (up to 20 oz.)
    • Multilayer RF Designs (up to 8 layers)
    • Oversized Boards (up to 37" x 120")

    AdvancedPCBs: Certifications

    We offer a range of certifications to help you meet your quality standards:

    • IPC 6012 Class 3 & 3A/ES
    • RoHS
    • REACH
    • PCB Board UL
    • ITAR
    • MIL-PRF-31032
    • MIL-PRF-55110
    • MIL-P-50884
    • AS9100D with ISO 9001:2015 
    • 31032 GI 8-layer 
    • Awarded IPC 1791 Qualified Manufacturers Listing (QML)

    Advanced PCBs: Laminates

    Deciding on the right laminate for your PCBs is an important part of the design process. The laminate used on your printed circuit boards will help achieve final thickness and give you a PCB that you can use for your application. At the end of the day, you need your circuit board to connect all of your components and work efficiently in the intended application. When you order your PCBs from AdvancedPCB you can get peace of mind knowing that the finished boards meet the toughest standards set by the industry for quality.

    Laminate
    Type
    Tg
    Celsius
    Td
    Celsius
    T-260
    Minutes
    T-288
    Minutes
    Dk
    Df
    UL94
    Aluminum Clad





    @ 1 MHz
    @ 1 MHz



    130
    380


    4.8
    0.016
    V0
    Isola





    @ 1 GHz
    @ 1 GHz

    FR4 / Phenolic
    180
    340
    60
    30
    4.04
    @ 2 GHz
    0.021
    @ 2 GHz
    V0
    FR4 / Phenolic
    180
    340
    60
    >15
    4.01
    @ 2 GHz
    0.0200
    @ 2 GHz
    V0
    FR4
    135

    10

    4.34
    0.016
    V0
    FR4 High Temp
    170
    300
    10
    >2
    3.95
    0.0161
    V0
    FR4
    190
    360
    60
    >30
    3.69
    0.0091
    V0
    Modified Epoxy
    225
    364
    60
    >20
    3.58
    0.0059
    V0
    Polyimide
    260
    416
    60
    60
    3.78
    0.0172
    HB
    Polyimide
    260
    396
    60
    60
    3.78
    0.0172
    V0
    Nelco





    1 GHz
    2.5 GHz

    FR4 High Temp
    175
    325
    4-8

    4.0
    @ 2.5 GHz
    0.022
    V0
    Modified Epoxy
    175
    345
    30

    4.1
    0.02
    V0
    Modified Epoxy
    190
    350
    >60

    3.7
    0.008
    V0
    Modified Epoxy
    210 - 240
    350
    >30
    >10
    3.7
    0.009
    V0
    N4000-6 SI/EP
    Modified Epoxy
    210 - 240
    350
    >30
    >10
    3.7
    0.009
    V0
    FR4 High Temp
    175 - 185
    350
    >60
    15
    4.3
    0.015
    V0
    Arlon





    1 MHz
    1 MHz

    Cer/Glass
    250
    407
    >60
    >60
    4.2
    0.01
    HB
    Rogers





    8-40 GHz
    10 GHz

    PTFE / Glass

    500


    2.2
    0.0009
    V0
    PTFE / Microfiber

    500


    2.33
    0.0012
    V0
    Cer/PTFE

    500


    2.94
    0.0012
    V0
    Cer/PTFE

    500


    6.45
    0.0027
    @ 10 GHz/A
    V0
    Cer/PTFE

    500


    10.7
    0.0023
    @ 10 GHz/A
    V0
    Cer/PTFE

    500


    3
    0.001
    V0
    Cer/PTFE

    500


    6.5
    0.002
    V0
    Cer/PTFE

    500


    11.2
    0.0022
    V0
    Cer/PTFE

    500


    3.02
    0.0016
    V0
    Cer/PTFE

    500


    10.8
    0.0027
    V0
    Hydrocarbon/Cer
    >280
    425


    3.55
    0.0027
    N/A
    Hydrocarbon/Cer
    >280
    390


    3.66
    0.0037
    V0
    Hydrocarbon/Cer
    >280
    390


    3.3 ± 0.05
    @ 10 GHz
    0.004
    V0
    Taconic





    10 GHz
    10 GHz

    PTFE / Glass




    3.2
    0.003
    V0
    PTFE / Glass




    2.95
    0.0028
    V0
    PTFE / Glass




    2.5
    @ 1 MHz
    0.0006
    @ 1 MHz
    V0
    PTFE / Glass

    553


    2.55
    0.0012
    @ 1.9 GHz
    V0

    Advanced PCBs: Multi-layer stackups

    For these or any specific stackup that you require, be sure to order as "Custom" and select "Controlled Dielectric". You may select ½, 1 or 2 ounce inner layer copper foil for your printed circuit board.

    Calculate the thickness of your custom stackup.

    The chart that we link to below provides the thickness for a single ply (sheet) of each style of Pre-Preg after processing. These are grouped by the weight and type of the internal conductor layer (typical signal and plane layers) that they will be adjacent to (columns A-F). Those that are adjacent to the top and bottom copper layers will use the column designated for these (column G) regardless of the layer type. All plies that are not directly against a conductor layer (use for situations with more than 2 plies in an opening) will use the additional plies values (column H). These values are based on a minimum of 2 plies of pre-preg per opening between foil and cores or between cores.

    Thickness guide (mils, 1/1000 inch)*,**

    A
    B
    C
    D
    E
    F
    G
    H
    Pre-Preg Styles
    Against core with .5 oz copper and signal traces utilizing 30% of the board area 
    Against core with .5 oz copper and signal traces utilizing 70% of the board area
    Against core with 1 oz copper and signal traces utilizing 30% of the board area
    Against core with 1 oz copper and signal traces utilizing 70% of the board area
    Against core with 2 oz copper and signal traces utilizing 30% of the board area
    Against core with 2 oz copper and signal traces utilizing 70% of the board area
    Against the top and bottom copper layers (foil)
    Additional plies that are not directly against conductor layers
    106
    1.9
    2.2
    1.5
    2.0
    0.5
    1.5
    2.3
    2.1
    1080
    2.6
    2.8
    2.1
    2.6
    1.1
    2.2
    3.0
    2.7
    2113
    3.5
    3.7
    3.0
    3.5
    2.0
    3.1
    3.9
    3.5
    2116
    4.7
    4.9
    4.2
    4.7
    3.2
    4.3
    5.1
    4.6
    7628
    6.5
    6.8
    6.0
    6.5
    5.0
    6.1
    6.9
    6.2

    *This thickness guide is provided as a guide only. The actual thickness will be affected by the copper distribution within the design as well as within the production panels

    **The dielectric thickness requirements supplied with an order will be interpreted with a minimum, 10% tolerance.

    Example:
     


    LayerLayer DescriptionThickness
    Layer 1
    Foil: 1 oz foil thickness 0.00135”
    0.00135”
    Prepreg topSheet 1 of Prepreg style 2116 (Column G, Row 2116: 5.1 mils)0.0051”
    Prepreg topSheet 2 of Prepreg style 2116 (Column C, Row 2116: 4.2 mils)0.0042”
    Layer 2Signal Plane: 1 oz foil thickness 0.00135”0.00135”
    CoreLaminate core 0.039”0.039”
    Layer 3Ground Plane: 1 oz foil thickness 0.00135”0.00135”
    Prepreg bottom
    Sheet 1 of Prepreg style 2116 (Column D, Row 2116: 4.7 mils)
    0.0047”
    Prepreg bottom
    Sheet 2 of Prepreg style 2116 (Column G, Row 2116: 5.1 mils)
    0.0051”
    Layer 4Foil: 1 oz foil thickness 0.00135”0.00135”
    Total thickness (Finish +/- 10%)0.0635”

    See the following table for the final thickness options of our multilayer boards:


    0.020"
    0.031"
    0.040"
    0.047"
    0.062"
    0.093"
    0.125"
    Max Board Size
    4-layer
    16” x 22”
    6-layer
    X
    16” x 22”
    8-layer
    X
    X
    X
    X
    16” x 22”
    10-layer
    X
    X
    X
    X
    14” x 20”
    11-layer and up
    X
    X
    X
    X
    >14” x 20”

    Advanced PCBs: Board Finishes

    It’s important to have the PCBs finished so their materials will not decay and so there is a consistent surface for connecting components to the board. We can provide you with UL-approved circuit boards with a tin copper alloy lead-free solder finish that meets the requirements of RoHS, REACH and Conflict Metals regulations. See the list of available board finishes for Advanced PCBs.

    Electrical Test

    We use two types of testing equipment on your circuit boards: 

    • Fixtureless: Flying probe with Everett Charles ATG test machines 
    • Fixture-based: Universal grid testing
     Flying Probe TestingFlying probe testing Universal grid testing

    Engineering FAQs


    Contact us

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